Yizhuo · Xi'an
R&D, reliability engineering, incoming QC, and release screening — including Industrial WT (−40~85°C) and Industrial Ext (−55~105°C) grades where applicable.
Industrial storage
In-house industrial memory & SSD — Xi'an QA, Ningbo shipment
Not a trader — we design, screen, and stand behind every program we release
Loongtion owns industrial-grade storage programs — memory chips, SSDs, and modules for control, edge, and embedded systems in wide-temperature enclosures.
We design and test in-house; we do not relabel consumer parts as industrial.
One chain from Xi'an (Yizhuo) engineering and QA to Ningbo (Loongtion) shipment — BOM review, samples, and production on the same inquiry thread.
Remote review covers pinout, footprint, and incumbent part numbers before you commit.
Programs that need wide temperature, documented NAND, and field endurance — telecom edge, SCADA, factory automation, IPC, energy, and transportation.
Engineering and QA in Xi'an · contracts and global logistics from Ningbo
R&D, reliability engineering, incoming QC, and release screening — including Industrial WT (−40~85°C) and Industrial Ext (−55~105°C) grades where applicable.
Sales, contracts, quotations, and global logistics for export programs.
Solder-down memory chips, removable M.2 NVMe, and socket-mounted SATA DOM — each program documented with datasheets and engineering support
Six solder-down lines · one unified program
DDR3, DDR4, DDR5, LPDDR4X, eMMC 5.1, and NVMe BGA SSD — Industrial WT and Industrial Ext grades, JEDEC-aligned design, remote BOM and footprint review.
Wide-temp TLC · published TBW · 2280 & 2242
PCIe 3.0 ×4 · NVMe 1.4 modules for 7×24 field duty — operating −40°C to +85°C, storage −45°C to +90°C, with DRAM-less and cached 2280 lines plus compact 2242.
SLC boot storage · DOM socket footprint
Disk-on-module SATA for motherboard DOM slots — SLC flash, 8 / 16 / 32 GB, SATA II, Samtec SQT-104-01-L-D connector, designed as a cross for Kontron KSSD S-DOM and similar incumbent parts.
Direct engineering, documented specs, and screening before release — not retail packaging
Email BOM, drawings, or incumbent part numbers — we reply on your thread with PDF datasheets and quotations (usually within 24 hours Mon–Fri UTC+8). Same engineers own fit review, sample support, and production release. Large or small programs receive the same care; we do not turn away low-MOQ inquiries when a line is in scope.
In-house design with materials, firmware criteria, and release testing under our control — built for industrial temperature and endurance, not desk retail repackaging.
Electrical and environmental screening before release; GB/T 19001-2016 / ISO 9001:2015 quality system and in-house test capability at Yizhuo (Xi'an).
Wide-temperature grades for cold outdoor starts, sealed hot cabinets, factory edge heat, and transport thermal cycles — not unlabeled 0–70°C consumer parts.
Pinout, footprint, memory map, and incumbent PN cross-check — free first step on your inquiry thread before you commit to samples or bulk.
TBW on M.2 NVMe, SLC on SATA DOM, pSLC/TLC tiers on eMMC and NVMe BGA — specs you can plan qualification around.
Five-year warranty on industrial M.2 NVMe and SATA DOM SKUs; 5-year free-replacement program on qualified bulk memory-chip orders under normal operating conditions.
Full PDF datasheets (timing, package, ordering info, environmental grades), pad dimensions, MSL, and reflux guidance per line.
Sample quantities typically 1–5 pcs per PN for socket fit, burn-in, and platform validation before bulk commitment.
Reliability is what we test before release — not a line on a consumer label
Operating −40°C to +85°C (Industrial Grade I) on SSD lines; Industrial WT and Industrial Ext on memory chips where listed. Storage −45°C to +90°C per datasheet. Programs that run 7×24 in outdoor cabinets, telecom edge, and industrial IPC cannot gamble on undocumented NAND or missing TBW.
JEDEC-aligned DDR3/DDR4/DDR5 and LPDDR4X; eMMC 5.1 (JESD84-B51.1); NVMe 1.4; RoHS-aligned, lead-free designs. Civilian industrial and infrastructure use — not marketed for military or defense end-use.
The same structure we document on our industrial M.2 NVMe and SATA DOM programs applies across the portfolio.
Materials selection, firmware criteria, release testing, and direct engineering — for industrial temperature and endurance, not consumer shelf life.
Lot screening and environmental test in Xi'an; ISO9001-backed incoming and release procedures before Ningbo shipment.
Firmware review, incumbent cross-reference, durability planning, and field-issue follow-up by email — hi@loongtion.com on your project thread.
Loongtion and Yizhuo program credentials — full copies included in your quotation pack on request.
Every released SKU is backed by documented specs, screening before shipment, and engineers who own the program.
Temperature grades, NAND type, TBW, connector/part numbers, and ordering tables in PDF datasheets — the same detail we publish on our industrial memory chips, M.2 NVMe, and SATA DOM programs.
All industrial M.2 NVMe and SATA DOM SKUs carry a five-year warranty; qualified bulk memory-chip programs include a 5-year free-replacement plan under normal operating conditions (non-human damage).
Loongtion and Yizhuo business licenses, high-tech enterprise recognition, ISO9001 certificate, Loongtion trademark, and Yizhuo patents — full copies in your quotation pack when you ask.