Yizhuo · Xi’an
R&D, reliability engineering, incoming QC, and release screening — including Wide-temp (−40°C to +85°C) and Extreme-temp / GJB-standard grades where datasheets list them.
About Loongtion — industrial DRAM, SSD, Card & Module
Wide-temperature storage designed and screened in-house: Xi’an engineering & QA, Ningbo shipment — flexible MOQ, layered customization, and GJB-standard options when programs require them.
Who we are: an industrial storage manufacturer, not a trading desk
We design, screen, and stand behind every program we release — memory, SSD, cards, and modules for control, edge, and embedded systems.
Ningbo Loongtion Intelligent Technology Co., Ltd. Brand: Loongtion
Loongtion (龙瑆) — industrial storage programs under one quality chain
Ningbo Loongtion Intelligent Technology Co., Ltd. (Loongtion) manufactures wide-temperature industrial storage across DRAM, SSD, Card, and Module form factors for control, telecom edge, IPC, energy, and transportation platforms.
We design and test in-house through the Xi’an (Yizhuo) engineering and QA chain; we do not relabel consumer parts as industrial.
In the spirit of the Loong — forward, resilient, ambitious — we grow when your program succeeds.
One accountable chain from Xi’an engineering to Ningbo shipment
BOM review, samples, and production stay on the same inquiry thread — from Xi’an (Yizhuo) design, reliability, and release screening to Ningbo (Loongtion) contracts and global logistics.
Remote review covers pinout, footprint, temperature grade, and incumbent part numbers before you commit to samples or bulk.
Markets and platforms we support with wide-temp storage
Programs that need documented temperature grades, published endurance where it matters, and field duty in outdoor cabinets, factory edge, and sealed industrial enclosures.
- Industrial control
- Outdoor telecom & edge
- Embedded & IPC
- Energy & SCADA
- Transportation
- Factory automation
- Automation gateways
- Harsh-environment edge
Why OEMs and design teams choose Loongtion
Manufacturer advantages that show up in BOM review, pilot builds, and long-lifecycle production 鈥?not trading-desk slogans.
Three temperature grades, one coherent portfolio
Commercial (0–70°C), Wide-temp (−40°C to +85°C), and Extreme-temp / GJB-standard (SKU-defined envelopes per handbook) — DRAM, SSD, Card, and Module under the same engineering and release discipline.
Low MOQ, BOM review, and firmware adaptation
Start from 1 pc for prototype bring-up and repairs. We help shortlist replacements, review fit / drop-in risk, and can modify firmware or grade on mature models — then scale on a typical 4–8 weeks production lead time.
Layered customization — from quick tweaks to new designs
Adjust temperature grade, firmware, silkscreen, and feature sets on mature SKUs, or open a dedicated development path when catalog parts cannot meet the platform.
Minimum 5-year supply commitment
Qualified industrial SKUs stay available for at least 5 years after qualification — including legacy configurations — with a minimum 12-month end-of-life notice before any discontinuation. Longer commitments can be negotiated for program forecasts.
5-year warranty, ISO process, and GJB-standard options
Qualified industrial SKUs carry a 5-year limited warranty (see /warranty). Xi’an engineering and release screening, ISO9001 process control, and GJB-standard grade options when programs need extended reliability documentation — not consumer parts relabeled as industrial.
Two centers, one accountable industrial storage program
Engineering, reliability, and release screening in Xi’an — contracts, quotations, and global logistics from Ningbo.
- 2015 Xi’an engineering & QA since
- Full DRAM chips · SSD · Card · Module
- GJB-STD Selected Extreme-temp / high-end SKUs when programs require it
- ISO9001 Incoming & release quality system
Loongtion · Ningbo
Sales, contracts, quotations, and global logistics for China integrators and export programs on the same engineering thread.
How we work with your BOM, drawings, and incumbent PNs
Email a BOM, drawings, or incumbent part numbers — we usually reply within 24 hours on China business days (Mon–Fri, UTC+8; excl. public holidays) with PDF datasheets and quotations. The same engineers own fit review, sample support, and production release, including low-MOQ pilots.
Engineering deliverables on your project thread
Datasheets and design-in packs
Full PDF datasheets (timing, package, ordering info, environmental grades), pad dimensions, MSL, and reflow guidance per line.
Qualification sample support
Sample quantities typically 1–5 pcs per PN for socket fit, burn-in, and platform validation before bulk commitment.
Registration, IP, and quality documentation you can request
Loongtion and Yizhuo program credentials — full copies included in your quotation pack on request.
Business registration & enterprise recognition
ISO9001, trademarks & patents
Built for field duty: wide temperature, documented endurance, industrial standards
Wide-temp and Extreme-temp grades for 7×24 industrial duty
Wide-temp (−40°C to +85°C) across industrial SSD and memory lines where listed; Extreme-temp / GJB-standard grades for programs that need operation above 85°C. Storage and operating ranges follow each datasheet — not unlabeled consumer bins.
JEDEC-aligned design and RoHS-aligned, lead-free builds
JEDEC-aligned DDR3/DDR4/DDR5 and LPDDR4X; eMMC 5.1 (JESD84-B51.1); NVMe 1.4; RoHS-aligned, lead-free designs for civilian industrial and infrastructure use.
Three pillars behind every industrial release
The same structure we document on industrial M.2 NVMe, SATA DOM, and solder-down memory programs applies across the portfolio.
In-house storage programs
Materials selection, firmware criteria, release testing, and direct engineering — for industrial temperature and endurance, not consumer shelf life.
Xi’an screening before dispatch
Lot screening and environmental test in Xi’an; ISO9001-backed incoming and release procedures before Ningbo shipment.
Direct engineering access
Firmware review, incumbent cross-reference, durability planning, and field-issue follow-up on your project thread.
What OEM and design teams can expect from every Loongtion program
Every released SKU is backed by documented specs, screening before shipment, and engineers who own the program.
Documented specs, not marketing adjectives
Temperature grades, NAND type, TBW where applicable, connector/part numbers, and ordering tables in PDF datasheets — the same detail we publish across DRAM, SSD, Card, and Module lines.
Multi-year warranty on qualified industrial programs
Qualified industrial SSD programs carry a five-year warranty; qualified bulk memory-chip programs include a multi-year free-replacement plan under normal operating conditions (non-human damage).
Credentials and qualification packs on request
Business licenses, high-tech enterprise recognition, ISO9001 certificate, trademark, and patents — full copies in your quotation pack when you ask.
Industrial storage portfolio across DRAM, SSD, Card, and Module
Browse by form factor — each family ships with datasheets, temperature grades, and application-engineering support on the same inquiry thread.
DRAM & solder-down memory
DDR3 · DDR4 · DDR5 · LPDDR4X · eMMC · related BGA lines
Industrial memory chips and solder-down storage for embedded controllers — Wide-temp and Extreme-temp / GJB-standard grades where listed, with remote BOM and footprint review.
Browse →Industrial SSD
SATA · NVMe · M.2 · BGA · wide-temp & commercial bins
2.5" SATA, M.2 SATA/NVMe, and BGA SSD programs for 7×24 industrial duty — documented temperature grades and endurance where the datasheet publishes them.
Browse →Industrial memory cards
CF · CFast · microSD
Rugged card form factors for industrial imaging, logging, and removable storage where solder-down or M.2 is not the right fit.
Browse →Storage modules
SATA DOM · SDC · LGA · Micro DOC
Socket and module footprints for boot and data storage — including SATA DOM crosses for incumbent industrial boards.
Browse →Coverage across form factors and temperature grades
DRAM chips, SSD, industrial cards, and storage modules — including scarce embedded footprints platforms still need.
Four form families on one inquiry thread
DRAM (DDR3 / DDR4 / DDR5 / LPDDR4X and related solder-down lines), SSD (SATA / NVMe / BGA), Card (CF / CFast / microSD), and Module (SATA DOM, SDC, LGA, and related) — one engineering reply path from BOM to samples.
Full temperature matrix for harsh-duty design
Commercial for stable ambient duty, Wide-temp for industrial −40°C to +85°C, and Extreme-temp / GJB-standard grades above 85°C where the datasheet lists them.
China-localization and second-source packages
China-made / controllable supply-chain options for localization and substitution programs, with incumbent PN cross-check before you commit.
Procurement, delivery, and long-cycle supply
Flexible entry for R&D, predictable output for production, and supply protection after qualification.
Flexible procurement threshold for R&D and pilots
Low MOQ (1 pc) supports prototype bring-up and small-batch pilots — no large inventory lock-in before the platform is locked.
Delivery assurance on a 4–8 weeks standard lead time
Stable production scheduling with a typical 4–8 weeks standard lead time once the configuration and forecast are agreed.
Minimum 5-year supply after qualification
Qualified equipment models stay on long-cycle supply for at least 5 years — including legacy SKUs — with end-of-life notices issued at least 12 months in advance. Longer program commitments can be negotiated.
Domestic and export dual-track support
Serve China industrial integrators and overseas programs with bilingual materials, foreign-currency quotes, and split shipments when needed.
Customization and embedded engineering support
From fast configuration changes on mature models to dedicated new storage designs when catalog SKUs are not enough.
Quick customization on shipping models
Fine-tune temperature grade, firmware, silkscreen, and feature configuration on mature SKUs without starting from a blank sheet.
Dedicated development when the catalog falls short
Take on customer-exclusive storage development when form factor, endurance, or interface requirements exceed the published lineup.
Embedded bring-up and compatibility support
Application engineering support for motherboard fit, bring-up, and soft/hardware matching issues on your project thread.
Quality, environmental test, and traceability
Market-proven industrial shipping with standardized process control and archives for equipment qualification.
Field-proven industrial shipping history
Long-term industrial volume, multi-scenario on-device validation, and GJB-standard delivery history where programs require it.
ISO9001 quality system at the release chain
ISO quality management with standardized production and release process control from Xi’an screening through Ningbo shipment.
Environmental test reports and material traceability
High/low temperature, vibration/shock, humidity/salt spray, and EMC test coverage with reports and material traceability archives for qualification packs.
Talk with application engineering about fit, grade, and volume
Share interface, capacity, temperature grade, and volume — we will map the right SKU or customization path.