Rows with a green check are published with datasheet or application-note backing.
Families listed as pending are common incumbent BOM searches — send your exact part number for engineering sign-off before we add them to the catalog.
Loongtion PN:
YZ48G08V-F7HPI-M(0), YZ48G08V-F7HPI-M, YZ48G16V-F9HPI-M(0), YZ48G16V-F9HPI-M
Verified cross-reference: Micron MT40A1G8WE-075EAIT:B · Micron MT40A512M16JY-07EAIT:B · ChangXin CXDQ3BFAM-WQ:A
Pending engineering map: Micron MT40A* / MTA18ASF* (8Gb DDR4 industrial/automotive) · Samsung K4A8G085* / K4AAG165* (FBGA78/96 DDR4) · SK hynix H5AN8G8* / H5ANAG6* (DDR4 monolithic)
Industrial (−40~85°C) Micron PNs are in the datasheet Equivalent Foreign Model column. Extreme (−55~105°C) grades have no foreign PN in the PDF — BOM review required.
Loongtion PN:
YZ38E16SBB-9MFB-M(0), YZ38E16SBB-9MFB-M, YZ38F16SBB-9MFD-M(0), YZ38F16SBB-9MFD-M…
Pending engineering map: Micron MT41K128M16* / MT41K256M16* (2Gb/4Gb x16 FBGA96) · Samsung K4B4G1646* / K4B8G1646* (DDR3 FBGA96) · SK hynix H5TC4G63* / H5TC8G63* (DDR3L/DDR3 wide temp)
JEDEC DDR3 FBGA96 solder-down ICs — high EOL search volume. Engineering must map exact incumbent PN per density/speed before publishing.
Loongtion PN:
YZ5GG16W-9CXDQ-M(0), YC5GG16W-9CXDQ-M(0)
Pending engineering map: Micron MT62F1G32D4DS* / MT60B2G8HB* (16Gb DDR5) · Samsung K3LK6K60* (DDR5 monolithic) · SK hynix HMCG94MEB* (DDR5 embedded)
16Gb 2Gb×8 WBGA-82 — confirm speed bin (4800/5600/6400 MT/s) and on-die ECC requirements before cross-ref publish.
Loongtion PN:
YZDB5CCBM-EA-A, YZDB6CCBM-EA-A, YZDB6CBAM-MA-B, YZDB6CCDM-EA-A…
Pending engineering map: Samsung K3LKBKB* / K3LK6K6* (LPDDR4X 200-ball) · Micron MT53E* / MT53D* (LPDDR4X) · SK hynix H9HCNNNB* (LPDDR4X)
SoC-specific memory map — dual-channel vs x16 die matters. Cross-ref only after ball-map review with customer schematic.
Loongtion PN:
YMDL008MNS-S, YMDL016MNS-S, YMDL032MNS-S, YMDL064MNS-S
Pending engineering map: Samsung KLMBG* / KLMxG* (industrial eMMC) · Micron MTFC* (eMMC / managed NAND) · SK hynix H26T* (eMMC)
Functional cross-reference by capacity, JESD84-B51.1, and temp grade — not pin-to-pin vs raw NAND.
Loongtion PN:
YIDF032NMS-S, YIDF064NMS-S, YIDF128NMS-S, YIDF256NMT-S…
Pending engineering map: Form-factor / protocol alternatives (not DRAM PN cross-ref)
Compare by PCIe Gen3 x4/x2, capacity, and temp — incumbent SSD PNs differ by vendor firmware. Use functional alternative wording only.
Loongtion PN:
YIDP008SAS-D, YIDP016SAS-D, YIDP032SAS-D
Verified cross-reference: Kontron KSSDS-DOM series
Pending engineering map: InnoDisk SATADOM-* / Apacer SDM-* (vertical SATA DOM)
Kontron KSSDS-DOM documented in Loongtion SATA DOM datasheet application note.
Loongtion PN:
YIDE* / YMDE* series per capacity
Pending engineering map: Micron 5300/5400, Samsung PM893, Intel/Solidigm D3-S4510 (by interface + form factor)
SSD cross-ref is interface/form-factor/capacity/temp — not semiconductor PN substitution. FAQ already covers Micron/Samsung replacement parameters.
