Industrial Memory Chips, DRAM & SSD
Industrial memory chips and embedded DRAM, plus SSD, Card, and Module across three temperature grades: Commercial (0–70°C) for office, indoor, and controlled ambient platforms; Wide-temp (−40°C to +85°C) for factory floors, outdoor cabinets, transportation, energy, and edge gear; and Extreme-temp / GJB-standard with SKU-defined envelopes (handbook examples: −55°C to +95°C, −55°C to +125°C, −40°C to +105°C) for the harshest industrial and infrastructure programs. Filter by form, grade, or interface to shortlist the right SKU — datasheets define the exact envelope per product. Commercial terms: minimum 5-year supply with 12-month EOL notice; MOQ from 1 pc; BOM review and firmware adaptation on request; 5-year warranty; typical 4–8 weeks lead time.
8Gb DDR4 DRAM Chip · Wide-temp
- Both wafer and package
- FBGA78/FBGA96 package
- Supports VDD(VDDQ) 1.2V +/-
8Gb DDR4 DRAM Chip · Wide-temp · CN
- DDR4 bandwidth
- China-localized supply (CN)
- Drop-in planning
DDR3 DRAM Chip · Extreme · CN
- FBGA96 · ×16
- Dual-voltage rail
- China-localized supply (CN)
DDR3 DRAM Chip · Wide-temp · CN
- Both Wafer and Packaging &
- Standard SSTL Interface
- Supports Dual Voltages
Industrial 16Gb DDR5 DRAM Chip
- DDR5 bandwidth
- 1.1 V operation
- WBGA-82 · ×8
LPDDR4X DRAM Chip
- Slim FBGA178/FBGA200 package
- 0.6V core ultra-low voltage
- 100% domestic solution
eMMC pSLC
- Encapsulates NAND flash
- Complies with the eMMC 5.1
- Clock speed up to 400MHz
eMMC Storage Chip
- NAND Flash and controller
- Complies with the eMMC 5.1
- Operates over a wide
NAND Flash
- Complies with ONFI 4.0
- TLC type, 3000 P/E cycles
- I/O speed up to 800 MB/s
NAND Flash Storage Chip
- ONFI 4.0 standard interface
- TLC type with up to 3000 P/E
- BGA132 and BGA152 packages
NVMe BGA SSD · Extreme
- Adopts PCIe Gen3×4 interface
- Compared with traditional
- Supports multiple systems
NVMe BGA SSD · Wide-temp
- FBGA291 Package
- PCIe Gen3×4 Interface
- Environmental testing
SATA BGA SSD · Extreme
- Adopts multi-chip packaging
- SATA III 6Gbps interface
- Can replace the uSSD chip
SATA BGA SSD · Wide-temp · CN
- High Quality from Component
- SATA III 6Gbps Protocol
- FBGA156 Package
SD NAND
- Compatible with SD 3.0/2.0
- 1.8V/3.3V dual voltage
- Original factory
M.2 2242 NVMe SSD (Cacheless)
- Dimensions
- Capacities from 512GB to 1TB
- Compatible with Industrial
M.2 2242 SATA SSD (Cacheless) · Commercial
- M.2 2242 Ultra-small Form
- Low Power Consumption Design
- 30% Lower Power Consumption
M.2 2242 SATA SSD (Cacheless) · Wide-temp
- Ultra-compact Form Factor
- Interface Protocol
- Environmental Resistance
M.2 2280 NVMe SSD (Cacheless) · Commercial
- PCIe 3.0 ×4 Lane
- Delivers over 3x higher
- 2TB version supports a wide
M.2 2280 NVMe SSD (Cacheless) · Wide-temp
- PCIe 3.0×4 Lanes
- Supports TRIM/NCQ/S.M.A.R.T
- Compatible with Industrial
M.2 2280 NVMe SSD (With Cache) · Commercia…
- 1GB Independent DRAM Cache
- Reduces NAND Flash
- 4TB Large Capacity Supports
M.2 2280 NVMe SSD (With Cache) · Wide-temp
- Independent DRAM cache
- PCIe 3.0×4 lane
- Compatible with Industrial
M.2 2280 SATA SSD (Cacheless) · Commercial
- M.2 2280 Standard Size
- SATA 3.2 Protocol for Stable
- 50% Smaller Volume
M.2 2280 SATA SSD (Cacheless) · Wide-temp
- Form Factor & Shielding
- Interface Protocol
- Environmental Resistance
Applications
All applicationsTypical industries where Loongtion wide-temp storage is designed in — with recent field notes below.