Wide-temp
−40°C to +85°C wide-temperature industrial memory and storage for factory floors, outdoor cabinets, transportation, energy, and edge devices. Designed for continuous duty across industrial thermal swings, with higher environmental robustness than Commercial. Use this grade when equipment must run reliably through cold starts, hot enclosures, and harsh civilian infrastructure — covering industrial DRAM, industrial SSD, Card, and Module lines. Commercial terms: minimum 5-year supply with 12-month EOL notice; MOQ from 1 pc; BOM review and firmware adaptation on request; 5-year warranty; typical 4–8 weeks lead time.
Wide-temp industrial coverage
Wide-temperature (−40°C to +85°C) industrial memory and storage is the default grade for factory floors, outdoor cabinets, transportation, energy, and edge outdoor gear. Use this hub when commercial 0–70°C parts are not enough for cold starts or hot sealed enclosures, but the program does not yet require extreme / GJB envelopes.
Selection path
Filter by form and interface, then confirm SKU-level ratings on the datasheet. Cross-check foreign PNs via cross-reference. For harsher envelopes, see extreme-temp / GJB; for indoor-only duty, see commercial grade.
8Gb DDR4 DRAM Chip · Wide-temp
- Both wafer and package
- FBGA78/FBGA96 package
- Supports VDD(VDDQ) 1.2V +/-
8Gb DDR4 DRAM Chip · Wide-temp · CN
- DDR4 bandwidth
- China-localized supply (CN)
- Drop-in planning
DDR3 DRAM Chip · Wide-temp · CN
- Both Wafer and Packaging &
- Standard SSTL Interface
- Supports Dual Voltages
Industrial 16Gb DDR5 DRAM Chip
- DDR5 bandwidth
- 1.1 V operation
- WBGA-82 · ×8
LPDDR4X DRAM Chip
- Slim FBGA178/FBGA200 package
- 0.6V core ultra-low voltage
- 100% domestic solution
eMMC Storage Chip
- NAND Flash and controller
- Complies with the eMMC 5.1
- Operates over a wide
NAND Flash
- Complies with ONFI 4.0
- TLC type, 3000 P/E cycles
- I/O speed up to 800 MB/s
NAND Flash Storage Chip
- ONFI 4.0 standard interface
- TLC type with up to 3000 P/E
- BGA132 and BGA152 packages
NVMe BGA SSD · Wide-temp
- FBGA291 Package
- PCIe Gen3×4 Interface
- Environmental testing
SATA BGA SSD · Wide-temp · CN
- High Quality from Component
- SATA III 6Gbps Protocol
- FBGA156 Package
SD NAND
- Compatible with SD 3.0/2.0
- 1.8V/3.3V dual voltage
- Original factory
M.2 2242 NVMe SSD (Cacheless)
- Dimensions
- Capacities from 512GB to 1TB
- Compatible with Industrial
M.2 2242 SATA SSD (Cacheless) · Wide-temp
- Ultra-compact Form Factor
- Interface Protocol
- Environmental Resistance
M.2 2280 NVMe SSD (Cacheless) · Wide-temp
- PCIe 3.0×4 Lanes
- Supports TRIM/NCQ/S.M.A.R.T
- Compatible with Industrial
M.2 2280 NVMe SSD (With Cache) · Wide-temp
- Independent DRAM cache
- PCIe 3.0×4 lane
- Compatible with Industrial
M.2 2280 SATA SSD (Cacheless) · Wide-temp
- Form Factor & Shielding
- Interface Protocol
- Environmental Resistance
mSATA SSD · CN · Wide-temp
- China-localized BOM (CN)
- mSATA footprint
- Dramless design
mSATA SSD (Cacheless)
- Dramless mSATA
- Import supply line
mSATA SSD (With Cache)
- DRAM cache
- TLC capacity ladder
- Import supply line
Data Recording Module
- Supports synchronous
- Independent offline working
- Industrial-grade storage
LGA Storage Module
- 48pin Surface-mount Design
- SATA III Protocol
- Capacities ranging
PATA DOM Module
- Fully Compatible
- Traditional PATA Interface
- Plug-in Design
PATA Micro DOC Module · Wide-temp
- 38-pin Non-standard PATA Bus
- Supports SLC (4GB~16GB)
- Equipped with Wear Leveling
SATA DOM Module · Wide-temp
- 36-pin Dual In-line Package
- SATA III Interface
- Compatible with VxWorks