Wide-temp · NAND Flash · DRAM

−40°C to +85°C wide-temperature DDR and LPDDR chips for industrial SoCs, edge compute, and embedded controllers. Advantages include stable industrial supply options, temperature bins matched to the field, and packages suited to compact board layouts. This view is limited to NAND Flash. Typical deployments: factory floors, outdoor cabinets, transportation, energy, and edge outdoor gear. Exact ratings stay SKU-specific in the datasheet. Commercial terms: minimum 5-year supply with 12-month EOL notice; MOQ from 1 pc; BOM review and firmware adaptation on request; 5-year warranty; typical 4–8 weeks lead time.

5-year supply · 12-month EOL notice
MOQ from 1 pc
BOM review & firmware fit
5-year warranty · 4–8 weeks lead time
NAND Flash
DRAM Wide-temp

NAND Flash

  • Complies with ONFI 4.0
  • TLC type, 3000 P/E cycles
  • I/O speed up to 800 MB/s
Temp -40℃~+85℃ Density 64GB-512GB
View specs →
NAND Flash Chip
DRAM Wide-temp CN

NAND Flash Chip

  • ONFI 4.0 standard interface
  • TLC type with up to 3000 P/E
  • BGA132 and BGA152 packages
Temp -40℃~+85℃ Density 64GB-512GB
View specs →

Applications

All applications

Typical industries where Loongtion wide-temp storage is designed in — with recent field notes below.

Industrial automation & PLC Long-life DDR3/DDR4 and SATA DOM for controllers that must stay in production for years.
Railway & transportation Extreme-temp Module / DOM options for vibration, shock, and harsh cabin climates.
Defense & aerospace GJB-standard / Extreme-temp grades when programs need extended reliability documentation.
Medical devices Wide-temp parts with multi-year supply planning for long equipment service lives.
Security & surveillance Industrial SSD and Card lines for always-on write duty and edge recorders.
Energy & power Wide-temp DRAM and storage for outdoor cabinets and unattended sites.