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NAND Flash

ONFI 4.0 Standard · TLC 3000 Program/Erase Cycles

Military-spec NAND Flash memory chips compliant with ONFI 4.0. TLC type with up to 3000 program/erase cycles, I/O speed up to 800 MB/s, and wide-temperature operation from -40°C to +85°C with enhanced reliability validation for rugged embedded applications.

Operating Temperature
-40℃~+85℃
Capacity Range
64GB-512GB
NAND Flash — product image
Product Features

Military-spec Reliable Storage Chip Solution

Enhanced-reliability tier with ONFI 4.0 interface, high-endurance TLC, and validated wide-temperature performance. Applicable GJB7400 N1 requirements are defined per SKU in the datasheet.

1

Complies with ONFI 4.0 standard interface

2

TLC type, 3000 P/E cycles, long service life and high reliability

3

I/O speed up to 800 MB/s for efficient data transmission

4

Operating temperature: -40°C to +85°C

5

GJB7400 N1 specification requirements apply per applicable datasheet

Technical Advantages

Technical Advantages

Military-spec Highly Reliable Storage Solution

1

High Quality

2

ONFI 4.0 Standard Interface, High Compatibility

3

TLC with 3000 P/E Cycles, Long Lifespan

4

I/O Speed up to 800MB/s, High-Efficiency Transmission

Technical Specifications

Specifications

Detailed Technical Specifications

Product Specifications

Interface Standard
ONFI 4.0
Package Type
BGA132/BGA152
Capacity Options
64GB/128GB/256GB/512GB
Operating Temperature
-40℃~85℃
Storage Temperature
-45℃~90℃
Flash Type
TLC (3000 P/E Cycles)
I/O Speed
800MB/s
CE Count
4CE
Supply Voltage
VCC (2.35V~3.6V), VCCQ (1.14V~1.26V)
Reliability Standard
Complies with the requirements of GJB7400 N1 specification
Replaceable Models
Compatible with Micron's models of the same type; some models are replaceable with MT29F2T08EMHAFJ4-3ITF:A, etc.
Warranty Period
5-year warranty service

Part Numbers

Orderable Part Numbers

Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.

Part Number Grade Specification
YKH8J132MZ Military-spec 128GB · BGA132 · TLC · ONFI 4.0 · -40℃~+85℃
YLJ8J132MZ Military-spec 256GB · BGA132 · TLC · ONFI 4.0 · -40℃~+85℃
YRK8J152NY Military-spec 512GB · BGA152 · TLC · ONFI 4.0 · -40℃~+85℃
YZ09TC1B1HC6C Military-spec 64GB · BGA132 · TLC · ONFI 4.0 · -40℃~+85℃
YZ09TC1B1JC6C Military-spec 64GB · BGA152 · TLC · ONFI 4.0 · -40℃~+85℃

Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.

Application Cases

Application Cases

Highly Reliable Scenario Validation

1

Industrial Recorder

Applied to industrial recorders, high I/O rate ensures fast data writing, and high quality meets high reliability requirements.

Application Effects

  • High-speed I/O ensures data writing
  • High quality and high reliability
  • Complies with GJB7400 N1 specification
2

Specialized Data Storage Device

Used in specialized data storage devices, TLC has 3000 P/E cycles for long lifespan and can operate stably in extreme environments such as vibration and high pressure.

Application Effects

  • TLC with 3000 P/E cycles for long lifespan
  • Resistant to extreme environments
Product grade definition

What “Military-spec” means on this website

How we use this label on our site — reliability tier, documentation, and use-case boundaries.

On this website, “Military-spec” refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.

Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).

GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product’s technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).

Important: “Military-spec” does not mean the products are marketed as dedicated for military end-use, and it does not imply government endorsement or inclusion on any procurement qualified list, unless separately documented on a dedicated page with authoritative evidence.

Customers are responsible for ensuring lawful procurement and use under applicable laws and regulations.

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High-quality 8Gb DDR4 DRAM chip, based on high-quality original Jinyuan dies, undergo packaging, testing and wide-temperature screening, making them compatible with industrial and specialized scenarios. With an operating frequency of 3200MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and include documented cross-reference for select Micron FBGA78/FBGA96 industrial part numbers — verify pin map and speed grade with our datasheet before qualification

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Memory Chips

High-quality DDR3 memory chips are based on high-quality original JinYuan dies. Their packaging, testing and wide-temperature screening comply with high-standard specifications. Featuring an operating frequency of 800MHz or 933MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and offer JEDEC-aligned cross-reference for select incumbent part numbers — verify with our datasheet and BOM review before qualification.

eMMC pSLC — product image
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Military-spec eMMC pSLC Storage Chip integrates NAND flash chips and controller in a single BGA package, complies with the eMMC 5.1 standard, features a clock speed of up to 400MHz, supports wide-temperature operation ranging from -55℃ to 105℃, and is compatible with Chinese platforms including Loongson, Phytium, Rockchip, etc.

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