Loongtion
Industrial NVMe BGA for boards that cannot take an M.2 module
For hardware and component engineers at industrial / embedded OEMs — solder-down FBGA291 NVMe SSD chips, Industrial WT and Ext / GJB-STD grades. Free datasheet, ball-map review, low MOQ.
- FBGA291solder-down NVMe
- −40~85°CIndustrial WT
- GJB-STDExt line where listed
- Low MOQfrom 1 pc when stocked
GJB-STD on the Ext line is a product grade — reliability tier and documentation, not a military end-use claim. Read the product grade definition
If you own the BOM, this will sound familiar
- An M.2 socket is too tall or too loose for the enclosure — you need solder-down NVMe.
- Incumbent BGA SSD going EOL with no clear pin-compatible or functional path.
- Quotes without a firm window — or a catalog that mixes module SSDs with BGA chips.
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Inquire free Datasheet PDF + quotation on your email thread.
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Confirm fit Remote ball-map / capacity / temp-grade review before you commit.
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Evaluate, then scale Low MOQ when stocked; bulk typically 4–8 weeks.
Two NVMe BGA lines
Solder-down NVMe chips only — M.2 2280/2242 modules are on /lp/nvme-industrial. Free datasheet PDF on each line.
Industrial NVMe BGA SSD · Wide-temp
Solder-down NVMe for space- and weight-limited boards — not an M.2 module campaign.
32GB–1TB · PCIe NVMe · FBGA291 · TLC / pSLC by PN
Industrial WT −40~85°C (per PN)
Industrial NVMe BGA SSD · Ext / GJB-STD
Extended reliability tier for harsh-duty solder-down NVMe — GJB-STD as a product grade definition, not a military end-use claim.
32–512GB · PCIe Gen3×4 · FBGA291 · pSLC / TLC by PN
GJB-STD Ext bins (e.g. −40~105°C) where listed
Cross-reference incumbent PNs
Documented vendor → Loongtion mappings for BOM shortlisting. Always validate package, speed bin / firmware, and temperature grade on your host.
Browse the full cross-reference catalog · Ask engineering for a BOM match
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
- ISO 9001:2015 certified (GB/T 19001-2016) Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
- Conforms to GJB 9001C—2017 Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Environmental methods (GJB-STD)
For Extreme-temp / GJB-STD SKUs, environmental planning and screening reference the following methods. This is not a claim of third-party product certification under these standards.
- GJB 150A (aligned with MIL-STD-810 methods) Military equipment laboratory environmental test methods. GJB-STD SKUs are designed and screened with reference to GJB 150A; it is the Chinese military counterpart commonly mapped to MIL-STD-810 style environmental methods.
Product & interface standards
Catalog SKUs follow the industry specifications that define their form factor and host interface.
- Industry SSD host interfaces Host interface, command set, and form-factor behavior follow the applicable SATA, NVMe, or eMMC specification listed on the datasheet.
- NVM Express (NVMe) Command set and PCIe-attached storage behavior conform to the NVMe specification revision applicable to the listed SKU.
- PCI Express Physical and link-layer attachment follows the PCIe generation and lane width stated on the datasheet (for example PCIe 3.0 ×4).
Grade wording for Wide-temp vs Extreme-temp / GJB-STD: Product grade definition.
What this program is built for
- Solder-down NVMe, not M.2 FBGA291 NVMe for compact embedded hosts — M.2 2280/2242 lives on a separate campaign for module buyers.
- Wide-temp and Ext / GJB-STD lines Industrial WT for standard harsh cabinets; Ext / GJB-STD when the datasheet lists a higher reliability tier.
- One BGA NVMe team Both grades under one engineering owner — capacity, flash type, and incumbent fit on one thread.
- Pilot-friendly MOQ From 1 pc when stocked — prove reflow and host firmware before bulk.
Need the formal wording for GJB-STD? Product grade definition
Who ships this
Loongtion is a China-based industrial storage manufacturer — design and screening in Xi’an, shipment from Ningbo. Small-batch friendly for OEM pilots; not a trading desk.
What you receive
- PDF datasheet for the NVMe BGA line you select
- Commercial quotation (grade, capacity, qty, destination)
- Free ball-map / host fit review on request
No public price list. Pilot and bulk terms quoted per line. Qualified bulk programs may include a 5-year free replacement policy — ask on your quote thread.
FAQ
Who is this page for?
Hardware engineers selecting solder-down NVMe BGA SSD chips for compact industrial / embedded boards — not M.2 module buyers.
How is this different from /lp/nvme-industrial?
That page is M.2 2280/2242 modules. This page is FBGA291 solder-down NVMe chips.
What does GJB-STD mean here?
GJB-STD is a product grade on the Ext line: reliability tier and documentation. It does not mean the parts are marketed for military end-use.
What about SATA BGA or eMMC?
Different interfaces — SATA BGA and eMMC live on their own product pages / campaigns.
Do you publish a price list?
No. We quote by line, capacity, quantity, and destination so lead time and commercial terms stay accurate.
How fast do you reply?
Usually within one business day on China business days (Mon–Fri, UTC+8; excl. public holidays) — datasheet and quote on the same thread.