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NVMe BGA SSD

Miniaturized Design · PCIe Gen3×4 · Operating Temperature: -40℃~+85℃

Industrial NVMe SSD chip with BGA package features small size, light weight and low power consumption. It achieves Industrial high-speed storage via the high-speed PCIe interface and is compatible with high-end industrial embedded devices with limited space.

Operating Temperature
-40℃~+85℃
Capacity Range
64GB-512GB
NVMe BGA SSD — product image
Product Features

Designed specifically for high-end industrial embedded devices

Advanced Industrial architecture ensures stable performance in harsh environments.

1

FBGA291 Package, Physical dimensions 16.0mm×20.0mm×1.58mm, lighter than traditional SSDs

2

PCIe Gen3×4 Interface, Maximum sequential read speed up to 1800MB/s, maximum sequential write speed up to 1000MB/s

3

Wide-temperature operation range: -40℃~+85℃, storage temperature range: -45℃~+90℃, adaptable to extreme Industrial environments

4

Environmental testing and reliability comply with relevant provisions of GJB150A, supports multi-system compatibility (VxWorks, Linux, etc.)

5

Covers 64GB~512GB, compatible with Industrial high-frequency small-capacity data storage scenarios

Technical Advantages

Robust Industrial Technical Strength

Deeply Optimized Core Technologies Provide Reliable Assurance for Industrial Applications

1

FBGA291 Package, Compact Size for Easy Embedded Integration

2

PCIe Gen3×4 High-Speed Interface, Excellent Performance

3

Passed GJB150A Environmental Test, Meeting High Requirements

4

Supports Industrial Operating Systems such as VxWorks and Linux

Technical Specifications

Detailed Technical Parameters and Performance Specifications

Strict Industrial technical standards ensure product performance and quality

Product Specifications

Interface Type
PCIe Gen3×4 (NVMe)
Package Type
FBGA291
Dimension Specification
16.0mm×20.0mm×1.58mm
Capacity Options
64GB/128GB/256GB/512GB
Operating Temperature
-40℃~+85℃
Storage Temperature
-45℃~+90℃
Read Speed
Up to 1800MB/s
Write Speed
Up to 1000MB/s
Reliability Standard
Relevant Provisions of GJB150A
System Compatibility
VxWorks, Linux, etc.
Warranty Period
5 Years

Part Numbers

Orderable Part Numbers

Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.

Part Number Grade Specification
YIDF01TGLT-S Industrial Grade 1TB · -40℃~+85℃
YIDF032NMS-S Ind WT 32GB · pSLC · BGA291 · −40~85°C
YIDF064GLT-S Industrial Grade 64GB · -40℃~+85℃
YIDF064NMS-S Ind WT 64GB · pSLC · BGA291 · −40~85°C
YIDF128GLT-S Industrial Grade 128GB · -40℃~+85℃
YIDF128NMS-S Ind WT 128GB · pSLC · BGA291 · −40~85°C
YIDF256GLT-S Industrial Grade 256GB · -40℃~+85℃
YIDF256NMS-S Ind WT 256GB · TLC · BGA291 · −40~85°C
YIDF256NMT-S Industrial Grade 256GB · -40℃~+85℃ BGA291
YIDF512GLT-S Industrial Grade 512GB · -40℃~+85℃
YIDF512NMS-S Ind WT 512GB · TLC · BGA291 · −40~85°C
YIDF512NMT-S Industrial Grade 512GB · -40℃~+85℃ BGA291

Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.

Application Cases

Practical cases successfully applied in the industrial field

Real industrial application scenarios to verify the reliability and practicality of products.

1

Embedded Storage for Rugged Industrial Industrial Tablets

Applied to rugged Industrial industrial tablets, the compact package is compatible with compact designs, and the high-speed PCIe interface enhances system performance.

Application Effects

  • Miniaturized Package Compatible with Tablets
  • High-Speed Interface Improves System Response Speed
  • Passes High Reliability Tests
2

Industrial Devices for Replacing U.S. SMI PCIe BGA SSDs

Used in industrial devices to replace U.S. SMI solutions, achieving high-quality replacement and meeting high reliability requirements.

Application Effects

  • High-Quality Alternative to Imported Solutions
  • Compatible with Original System Design
  • Meets High Reliability Requirements
SATA BGA SSD — product image
BGA SSDs

High-quality, high-density integrated SATA BGA SSD chips, adopting multi-chip packaging technology, are compact in size, low in power consumption, and compatible with industrial embedded devices.

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