SSD Wide-temp CN

SATA BGA SSD · Wide-temp · CN

High-density Storage

Operating temperature -40℃~+85℃
Capacity 128GB-1TB
SATA BGA SSD · Wide-temp · CN

Key facts

What industrial buyers usually need to know first — before diving into the full datasheet.

5-year supply · 12-month EOL notice

Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.

MOQ from 1 pc

Prototype and repair lots without large inventory lock-in — then scale to production.

BOM review & firmware fit

We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.

5-year warranty · 4–8 weeks lead time

Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.

MOQ From 1 pc
Standard lead time 4–8 weeks (typical; confirm with sales for your configuration)
Warranty 5 years (see /warranty for tier details)
Supply commitment Minimum 5 years for qualified SKUs · 12-month EOL notice
Engineering support BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request
Samples Available on request

Overview

High-quality, high-density integrated SATA BGA SSD chips, adopting multi-chip packaging technology, are compact in size, low in power consumption, and compatible with industrial embedded devices.

Specifications

Interface SATA III 6Gb/s
Package FBGA156
Dimension Specification 16.0mm×20.0mm×1.9mm
Capacity Options 128GB/256GB/512GB/1TB
Operating temperature -40℃~+85℃
Storage temperature -45℃~+90℃
Read Speed Up to 450MB/s
Write Speed Up to 350MB/s
Warranty Period 5 Years

Orderable part numbers

Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.

Part numberGradeSummary
YIDN01TSKT-S Wide-temp 1TB · TLC · -40℃~+85℃
YIDN128SKT-S Wide-temp 128GB · TLC · -40℃~+85℃· xref Phison PSS5A324-X28
YIDN256SKT-S Wide-temp 256GB · TLC · -40℃~+85℃
YIDN512SKT-S Wide-temp 512GB · TLC · -40℃~+85℃

Compliance & Standards

Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.

Quality management system

  • ISO 9001:2015 certified (GB/T 19001-2016)
    Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
  • Conforms to GJB 9001C—2017
    Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).

Product & interface standards

This catalog SKU follows the industry specifications that define its form factor and host interface.

  • Industry SSD host interfaces
    Host interface, command set, and form-factor behavior follow the applicable SATA, NVMe, or eMMC specification listed on the datasheet.
  • Serial ATA (SATA)
    SATA interface timing and command set follow the SATA revision applicable to the listed SKU (commonly SATA III).

Grade wording: Product grade definition.

Key highlights

Advanced Industrial architecture, ensuring stable performance in harsh environments

  • High Quality from Component
    Design to Packaging
  • SATA III 6Gbps Protocol
    Sequential Read Speed Up to 450MB/s, Sequential Write Speed Up to 350MB/s
  • FBGA156 Package
    Physical Dimensions 16.0mm×20.0mm×1.9mm, In-situ Replacement for Phison Taiwan's uSSD Chip Solution
  • Covers 128GB~1TB
    Compatible with Compact Storage Requirements of High-Quality Industrial Equipment

Typical applications

Real industrial application scenarios verify the reliability and practicality of products.

High-Quality Industrial Embedded Motherboard Storage

Applied to high-quality industrial embedded motherboards, the high-quality solution meets high reliability requirements.

  • High quality meets high reliability requirements
  • Compact size compatible with embedded motherboards

Engineering guides