SATA BGA SSD
High-density Storage · Operating Temperature -40℃~+85℃
High-quality, high-density integrated SATA BGA SSD chips, adopting multi-chip packaging technology, are compact in size, low in power consumption, and compatible with industrial embedded devices.
Designed specifically for industrial embedded devices
Advanced Industrial architecture, ensuring stable performance in harsh environments
Robust Industrial Technical Strength
Deeply Optimized Core Technologies Provide Reliable Assurance for Industrial Applications
High Quality
Replaceable with Taiwan Phison uSSD Chips
Passed GJB150A Environmental Test
Small Size & High Density Integrated Design
Detailed Technical Parameters and Performance Specifications
Strict Industrial technical standards to ensure product performance and quality.
Product Specifications
- Interface Type
- SATA III 6Gb/s
- Package Type
- FBGA156
- Dimension Specification
- 16.0mm×20.0mm×1.9mm
- Capacity Options
- 128GB/256GB/512GB/1TB
- Operating Temperature
- -40℃~+85℃
- Storage Temperature
- -45℃~+90℃
- Read Speed
- Up to 450MB/s
- Write Speed
- Up to 350MB/s
- Reliability Standard
- GJB150A Environmental Test
- Warranty Period
- 5 Years
Practical cases successfully applied in industrial fields
Real industrial application scenarios verify the reliability and practicality of products.
High-Quality Industrial Embedded Motherboard Storage
Applied to high-quality industrial embedded motherboards, the high-quality solution meets high reliability requirements.
Application Effects
- High quality meets high reliability requirements
- Compact size compatible with embedded motherboards
Embedded Storage for Medical Devices
Used in high-quality medical devices, it has passed the GJB150A environmental test to ensure the security and reliability of medical data.
Application Effects
- High reliability safeguards medical data
- High quality meets high reliability requirements
- Miniaturized design saves space
Related technical resources
- Whitepaper Industrial NVMe BGA SSD Guide BGA NVMe SSD selection for embedded systems requiring solder-down storage.
- Whitepaper Industrial eMMC 5.1 Storage Guide Industrial eMMC 5.1 whitepaper covering endurance, temperature grades, and BGA integration.
- Technical Guide NVMe BGA SSDs for Solder-Down Embedded Storage: A Hardware Design Guide A practical guide to integrating NVMe BGA SSDs into embedded designs, covering PCB layout, power sequencing, thermal management, and reliability trade-offs versus removable M.2 modules.
- Article eMMC vs NAND Flash in Embedded Systems: Architecture, Trade-offs, and Selection Guide An in-depth technical comparison of eMMC and raw NAND flash for embedded and industrial applications. Covers architecture, reliability, performance, and practical selection criteria based on real product specifications.
Related products
NVMe BGA SSD
Industrial NVMe SSD chip with BGA package features small size, light weight and low power consumption. It achieves Industrial high-speed storage via the high-speed PCIe interface and is compatible with high-end industrial embedded devices with limited space.
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