SSD Wide-temp

M.2 2280 NVMe SSD (Cacheless) · Wide-temp

Cacheless · PCIe 3.0×4

Operating temperature -40℃~+85℃
Capacity 512GB-2TB
M.2 2280 NVMe SSD (Cacheless) · Wide-temp

Key facts

What industrial buyers usually need to know first — before diving into the full datasheet.

5-year supply · 12-month EOL notice

Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.

MOQ from 1 pc

Prototype and repair lots without large inventory lock-in — then scale to production.

BOM review & firmware fit

We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.

5-year warranty · 4–8 weeks lead time

Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.

MOQ From 1 pc
Standard lead time 4–8 weeks (typical; confirm with sales for your configuration)
Warranty 5 years (see /warranty for tier details)
Supply commitment Minimum 5 years for qualified SKUs · 12-month EOL notice
Engineering support BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request
Samples Available on request

Overview

Based on the NVMe protocol, this Industrial M.2 2280 SSD (SSD) adopts an architecture without independent cache. It leverages the PCIe 3.0×4 high-speed channel to break through the performance bottleneck of SATA, and is compatible with high-speed data processing scenarios in the industrial field (such as real-time image analysis, high-frequency data acquisition).

Specifications

Interface M.2 M KEY (PCIe 3.0×4, NVMe 1.4)
Physical Dimensions 80mm×22mm×≤5mm
Capacity Options 512GB/1TB/2TB
Operating temperature -40℃~+85℃
Storage temperature -45℃~+90℃
Read Speed Up to 1500MB/s
Write Speed Up to 1200MB/s
Cache Type Dramless (No Cache)
Thermal Design Optimized Thermal Dissipation
Warranty Period 5 Years
Package 80mm×22mm×≤5mm
Supported Features TRIM/NCQ/S.M.A.R.T, Wear Leveling Algorithm
Compatible Platforms Compatible with Industrial FPGA platforms such as Xilinx XC7020

Orderable part numbers

Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.

Part numberGradeSummary
YIDJ01TNXT-S Wide-temp 1TB · China-localized · TLC · -40℃~+85℃
YIDJ01TNZT-S Industrial Grade 1 TB · ≥2200/≥1400 MB/s · TBW 720 TB
YIDJ02TNZT-S Industrial Grade 2 TB · ≥2500/≥1800 MB/s · TBW 1400 TB
YIDJ256NXT-S Wide-temp 256GB · China-localized · TLC · -40℃~+85℃
YIDJ256NZT-S Industrial Grade 256 GB · ≥1500/≥700 MB/s · TBW 180 TB
YIDJ512NXT-S Wide-temp 512GB · China-localized · TLC · -40℃~+85℃
YIDJ512NZT-S Industrial Grade 512 GB · ≥2000/≥900 MB/s · TBW 360 TB

Compliance & Standards

Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.

Quality management system

  • ISO 9001:2015 certified (GB/T 19001-2016)
    Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
  • Conforms to GJB 9001C—2017
    Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).

Product & interface standards

This catalog SKU follows the industry specifications that define its form factor and host interface.

  • Industry SSD host interfaces
    Host interface, command set, and form-factor behavior follow the applicable SATA, NVMe, or eMMC specification listed on the datasheet.
  • NVM Express (NVMe)
    Command set and PCIe-attached storage behavior conform to the NVMe specification revision applicable to the listed SKU.
  • PCI Express
    Physical and link-layer attachment follows the PCIe generation and lane width stated on the datasheet (for example PCIe 3.0 ×4).

Grade wording: Product grade definition.

Key highlights

Advanced Industrial architecture ensures stable performance in harsh environments.

  • PCIe 3.0×4 Lanes
    supports NVMe 1.4 protocol, data transfer efficiency is more than 3 times higher than SATA
  • -40℃~+85℃ Wide-temperature
    Operation Optimized Heat Dissipation Design to Avoid Overheating in Enclosed Environments of Industrial Equipment
  • Capacity
    512GB~2TB, Sequential Read Speed up to 1500MB/s, Sequential Write Speed up to 1200MB/s
  • Supports TRIM/NCQ/S.M.A.R.T
    equipped with Wear Leveling Algorithm to extend flash memory lifespan
  • Compatible with Industrial
    FPGA platforms such as Xilinx XC7020, supports operating systems including Linux and VxWorks

Typical applications

Verify the reliability and practicality of products in real industrial application scenarios

High-Speed Storage for Industrial Machine Vision Systems

Applied to industrial machine vision systems, the high-speed PCIe interface meets the requirements of real-time image acquisition and analysis.

  • High-speed transmission meets real-time image processing requirements
  • Optimized heat dissipation adapts to continuous operation
  • High performance ensures visual analysis efficiency

Real-Time Data Caching for Specialized Testing Equipment

Used in specialized testing equipment, high-speed read/write meets real-time data caching requirements and is compatible with FPGA platforms.

  • High-speed read/write meets real-time caching requirements
  • Compatible with Industrial FPGA platforms
  • Wide-temperature operation adapts to specialized environments

Series

Engineering guides