Technical resources
Browse free whitepapers (with PDF download), selection guides, application notes, Q&A, and glossary entries for industrial DRAM, SSD, card, and module design-in. Use them to shortlist SKUs, check temperature and interface fit, and brief your BOM review — product catalog PDFs are on the Downloads page.
Q&A
Q&A
Why Use NOR Flash Instead of RAM?
RAM loses everything when power is removed. NOR Flash is non volatile and retains data after power off while still supporting the random access read speed…
Q&A
Can I Use a Standard SD Card in an Industrial System?
No. A retail or consumer grade SD card is rated for 0 °C to +70 °C and is not qualified for sustained operation outside that range. An industrial system ru…
Q&A
SATA DOM FAQ: Industrial Boot Drive Questions Answered
A SATA DOM (Disk on Module) is a solid state storage module that plugs directly onto a SATA connector. There is no cable, no separate enclosure, no power w…
Q&A
Can I Use a Consumer SSD in an Industrial Embedded System?
Using a consumer SSD in an industrial system often leads to premature failure, data corruption, or thermal throttling. Here is why industrial SSDs are engi…
Q&A
What Is the Difference Between Industrial and Commercial Temperature…
Industrial temperature memory (-40°C to +85°C) is tested and guaranteed to operate in extreme environments where commercial-grade (0°C to +70°C) memory wou…
Q&A
Wide-Temperature Industrial Storage — Common Engineering Questions
What engineering considerations are critical when selecting industrial storage and storage for -40°C to +85°C environments?Wide-temperature operation (-40°…
Q&A
What are the guidelines for trace impedance (e.g., 40Ω or 50Ω) for D…
What are the guidelines for trace impedance (e.g., 40Ω or 50Ω) for DDR3 signals and the required trace width for a given stack-up?The Loongtion DDR3 SDRAM…
Q&A
Is it acceptable to use through vias instead of blind or backdrilled…
Is it acceptable to use through vias instead of blind or backdrilled vias for DDR3 routing to reduce PCB costs?Routing DDR3 memory interfaces is a balance…
Q&A
How do I compensate for an unbalanced number of vias in DDR3 routing…
How do I compensate for an unbalanced number of vias in DDR3 routing, and what are the signal integrity implications?Unbalanced via count on a DDR3 data or…
Q&A
Why Does DDR3 Memory Have a BGA Footprint with Two Columns of Pads a…
What is the reasoning behind the unique BGA footprint of DDR3 memory packages, with two columns of pads and an empty column in between?The distinctive BGA…
Q&A
Can I swap data wires (e.g., connect DQ0 on the CPU to DQ1 on the me…
Can I swap data wires (e.g., connect DQ0 on the CPU to DQ1 on the memory) on the data bus between the CPU and a DDR3 x16 memory for routing optimization?Ye…
Q&A
For DDR3 layout, what is the acceptable skew tolerance (e.g., 25 mil…
For DDR3 layout, what is the acceptable skew tolerance (e.g., 25 mils) within a net class, and does the reset line require length matching?When designing a…
Q&A
How do I properly length-match the different signal classes (address…
How do I properly length-match the different signal classes (address/command/clock vs. DQ/DM/DQS) for DDR3 routing?Proper length matching ensures that all…
Q&A
What are the minimum number of PCB layers required for proper DDR3 f…
What are the minimum number of PCB layers required for proper DDR3 fanout and routing to keep costs down?When designing a cost-optimized system with DDR3 m…
Q&A
Systemd Boot Optimization: Why dev-mmcblk0p2.device Takes 4.5 Second…
In systemd analyze blame output, dev mmcblk0p2.device indicates the time systemd waited for the block device /dev/mmcblk0p2 to become available. On embedde…