SK hynix H26M64208EMR Alternative - Loongtion Functional Alternative
Functional Alternative Alternative for SK hynix H26M64208EMR — parameter alignment for BOM review, why evaluate Loongtion, FAQs, and datasheet and quote paths. Qualify on your board before swap.
H26M64208EMR
Also listed as
H26M52208FPR, H26M78208CMR, H26M41204HPR, SK hynix eMMC, SK hynix e-NAND, H26M*
YIDL*MNT-S (TLC WT) / YMDL*MNS-S (pSLC GJB)
Functional Alternative · Alternative
Summary
SK hynix e-NAND eMMC 5.1 in 153FBGA (11.5×13 mm) — public datasheets list H26M* densities (8–64 GB class). Shortlist Loongtion by protocol, package, capacity, and temperature; validate CID/CSD, partitions, and power sequencing on the SoC.
Parameter alignment
Key handbook fields side by side — confirm package, grade, and firmware against the datasheet for your build.
| Parameter | Loongtion | SK hynix |
|---|---|---|
| Standard | eMMC 5.1 | eMMC 5.1 (H26M e-NAND family) |
| Package | FBGA153 (11.5×13×1.0 mm) | 153FBGA 11.5×13 |
| Capacity | 8–256 GB by line | 8–64 GB typical (verify SKU) |
| Temperature | −40~+85°C / Extreme pSLC options | IT/auto grades (often −40~+85°C; verify SKU) |
Why evaluate Loongtion for this PN
Cross-reference is not only for discontinued parts — many OEMs qualify a Loongtion path as a second source next to SK hynix, then use it for dual-sourcing, allocation relief, or future EOL coverage.
- Second source — not only an EOL story Use this mapping to dual-source alongside SK hynix. Qualify Loongtion once so allocation, long lead times, or a future EOL on H26M64208EMR does not stop your line.
- Functional Alternative path for BOM review This page documents the Loongtion PN, key parameter alignment, and compatibility type. Treat it as engineering guidance — confirm package, speed/firmware, and temperature on your host before production.
- Industrial temperature grades where listed Loongtion lists −40~+85°C / Extreme pSLC options for this line. Match the ordering PN to your environmental requirement (commercial, wide-temp, or Extreme-temp / GJB where offered).
- Endurance / grade options for write-heavy duty Where the product line offers pSLC or higher-endurance grades, evaluate them for logging, boot, and always-on industrial workloads — not every incumbent SKU ships the same endurance class.
- Direct engineering and small-batch pilots Request the datasheet with your incumbent PN, board, and temperature grade. Typical engineering reply is within one business day on China business days — useful for pilots before you lock an AVL dual-source.
Typical applications
Common equipment contexts where engineers search for this part family or a compatible alternative.
- Embedded Linux / Android boards
- Industrial HMI and gateways
- Rugged tablets and handhelds
FAQs for this cross-reference
What does “Functional Alternative” mean for H26M64208EMR?
It means Loongtion YIDL*MNT-S (TLC WT) / YMDL*MNS-S (pSLC GJB) is a documented functional or form-factor path for BOM exploration versus SK hynix H26M64208EMR — not a blanket semiconductor interchangeability warranty. Confirm interface, package, capacity/density, firmware, and temperature on your host.
Can I use Loongtion as a second source while still buying SK hynix?
Yes — that is a common international OEM pattern. Qualify the Loongtion PN on your board, keep SK hynix as primary if required, and use Loongtion for allocation relief, cost/lead-time balance, or future EOL coverage.
What must I verify before substituting?
Match the critical interface and mechanical constraints (package / form factor, protocol, capacity, voltage, speed, endurance class). Then validate firmware behavior, power, and −40~+85°C / Extreme pSLC options on the target platform.
Can I evaluate the part before ordering?
Send the incumbent PN, application, temperature grade, and quantity. Engineering will confirm the closest Loongtion PN, evaluation terms, and lead time.
Related Loongtion products
Open a product page for specs, documents, and inquiry.
Related technical resources
Guides and notes that help qualify replacement, layout, and temperature choices.
Related cross-references
Other published mappings in the same product family.
| Vendor | Vendor PN | Loongtion PN |
|---|---|---|
| Micron |
MTFC8GAMALBH / MTFC64GAPALBH (eMMC 5.1 family)
|
YIDL*MNT-S (TLC) / YMDL*MNS-S (pSLC GJB)
|
| Samsung |
KLM8G1GETF
|
YIDL*MNT-S (TLC WT) / YMDL*MNS-S (pSLC GJB)
|
| Kioxia |
THGBMJG7C2LBAU8
|
YIDL*MNT-S (TLC WT) / YMDL*MNS-S (pSLC GJB)
|
Source: Verified: SK hynix e-NAND eMMC 5.1 datasheets (H26M41204HPR / H26M64208EMR / H26M* line-up). Functional alternative only.
All manufacturer names, logos, and part numbers (such as Micron, Samsung, SK hynix, Phison, Kontron, Silicon Motion, and others) used on this website are for cross-reference and identification purposes only. These trademarks remain the property of their respective owners. Loongtion is not an authorized distributor or affiliate of these manufacturers.
Need help qualifying this functional alternative?
Share the incumbent PN, target board, and temperature grade — we respond within one business day on China business days (Mon–Fri, UTC+8; excl. public holidays).