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eMMC pSLC

eMMC 5.1 Standard · Ultra-wide Temperature Range: -55℃~105℃ · FBGA153 Package

Military-spec eMMC pSLC Storage Chip integrates NAND flash chips and controller in a single BGA package, complies with the eMMC 5.1 standard, features a clock speed of up to 400MHz, supports wide-temperature operation ranging from -55℃ to 105℃, and is compatible with Chinese platforms including Loongson, Phytium, Rockchip, etc.

Operating Temperature
-55℃~105℃
Capacity Range
8GB-64GB
Clock Speed
400MHz
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eMMC pSLC — product image

Product Features

Military-spec Embedded Storage Solution

1

Encapsulates NAND flash memory chips and controller in a single BGA, compact in size

2

Complies with the eMMC 5.1 standard, supports I2-wire bus (CLK, CMD, data strobe, data bus and RST_n)

3

Clock speed up to 400MHz, supports Single Data Rate (SDR) and Double Data Rate (DDR), with optional bus width of 1-bit/4-bit/8-bit

4

Operating temperature range: -55℃~105℃, low power consumption and low heat generation, suitable for portable and embedded devices

5

Compatible with high-quality platforms such as Loongson, Phytium, Rockchip, etc., and compatible with Micron series product MTFCXXGJDDQ-4M

Technical Advantages

Technological Advantages

Military-spec Embedded Storage Solution

1

eMMC 5.1 Standard, High Compatibility

2

pSLC Technology, High Reliability

3

Ultra-wide Operating Temperature Range: -55℃~105℃

4

Compatible with High-quality Platforms Such as Loongson and Phytium

Technical Specifications

Specifications

Detailed Technical Specifications

Product Specifications

Interface Standard
eMMC 5.1
Package Type
FBGA153
Physical Dimensions
11.5mm×13.0mm×1.0mm
Capacity Options
8GB/16GB/32GB/64GB
Operating Temperature
-55℃~105℃
Storage Temperature
-45℃~90℃
Supply Voltage
Dual Voltage of 3.3V/1.8V
Flash Type
pSLC
Clock Speed
Up to 400MHz
Transfer Mode
Supports Single Data Rate (SDR) and Double Data Rate (DDR)
Bus Width
1-bit/4-bit/8-bit Optional
Compatible Platforms
Compatible with high-quality platforms such as Loongson, Phytium, Rockchip, etc.
Alternative Models
Compatible with Micron series product MTFCXXGJDDQ-4M
Warranty Period
5-Year Warranty Service
Application Cases

Application Cases

Embedded Scenario Validation

1

Rugged Handheld Devices

Applied to rugged handheld devices, pSLC technology ensures data reliability, and low-power design extends device battery life.

Application Effects

  • High Reliability with pSLC Technology
  • Low Power Consumption for Extended Battery Life
  • Compatible with High-Quality Platforms
2

Embedded Systems

Used in embedded systems, it features strong compatibility with the eMMC 5.1 standard and ultra-wide temperature operation to adapt to harsh environments.

Application Effects

  • Strong Compatibility with eMMC 5.1 Standard
  • Ultra-Wide Temperature Range for Harsh Environments
  • Compatible with Micron Series Products

What “Military-spec” means on this website

How we use this label on our site — reliability tier, documentation, and use-case boundaries.

On this website, “Military-spec” refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.

Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).

GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product’s technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).

Important: “Military-spec” does not mean the products are marketed as dedicated for military end-use, and it does not imply government endorsement or inclusion on any procurement qualified list, unless separately documented on a dedicated page with authoritative evidence.

Customers are responsible for ensuring lawful procurement and use under applicable laws and regulations.

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High-quality NAND Flash memory chips, compliant with ONFI 4.0 standard interface, TLC type with up to 3000 erase/write cycles, I/O speed up to 800MB/s, supports wide temperature operation from -40℃ to 85℃, and meets high requirements of Industrial.

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Memory Chips

High-quality DDR4 SDRAM, based on high-quality original Jinyuan dies, undergo packaging, testing and wide-temperature screening, making them compatible with industrial and specialized scenarios. With an operating frequency of 3200MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and are interchangeable with corresponding devices from Micron, Samsung and high-quality ChangXin, etc.

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DDR3 SDRAM — product image
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High-quality DDR3 memory chips are based on high-quality original JinYuan dies. Their packaging, testing and wide-temperature screening comply with high-standard specifications. Featuring an operating frequency of 800MHz or 933MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and are interchangeable with corresponding devices from Micron, Samsung and other manufacturers.

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Need application engineering or a custom storage solution?

Our engineers help with BOM review, compatibility validation, and storage selection for your project.

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