eMMC pSLC
eMMC 5.1 Standard · FBGA153 Package
Key facts
What industrial buyers usually need to know first — before diving into the full datasheet.
5-year supply · 12-month EOL notice
Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.
MOQ from 1 pc
Prototype and repair lots without large inventory lock-in — then scale to production.
BOM review & firmware fit
We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.
5-year warranty · 4–8 weeks lead time
Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.
| MOQ | From 1 pc |
|---|---|
| Standard lead time | 4–8 weeks (typical; confirm with sales for your configuration) |
| Warranty | 5 years (see /warranty for tier details) |
| Supply commitment | Minimum 5 years for qualified SKUs · 12-month EOL notice |
| Engineering support | BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request |
| Samples | Available on request |
Overview
Military-spec eMMC pSLC Storage Chip integrates NAND flash chips and controller in a single BGA package, complies with the eMMC 5.1 standard, features a clock speed of up to 400MHz, supports wide-temperature operation ranging from -55℃ to 105℃, and is compatible with Chinese platforms including Loongson, Phytium, Rockchip, etc.
Specifications
| Interface | eMMC5.1 |
|---|---|
| Package | FBGA153 |
| Physical Dimensions | 11.5mm×13.0mm×1.0mm |
| Capacity Options | 8GB/16GB/32GB/64GB |
| Operating temperature | −55°C to +125°C |
| Supply voltage | Dual Voltage of 3.3V/1.8V |
| Flash Type | pSLC |
| Clock Speed | Up to 400MHz |
| Compatibility | Loongson/Phytium/Rockchip |
| Warranty Period | 5-Year Warranty Service |
| Interface Standard | eMMC 5.1 |
| Storage temperature | -45℃~90℃ |
| Transfer Mode | Supports Single Data Rate (SDR) and Double Data Rate (DDR) |
| Bus Width | 1-bit/4-bit/8-bit Optional |
| Compatible Platforms | Compatible with high-quality platforms such as Loongson, Phytium, Rockchip, etc. |
| Alternative Models | Compatible with Micron series product MTFCXXGJDDQ-4M |
Orderable part numbers
Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.
| Part number | Grade | Summary |
|---|---|---|
YMDL008MNS-S |
GJB-STD | 8GB · pSLC · -55℃~+125℃· 153FBGA |
YMDL016MNS-S |
GJB-STD | 16GB · pSLC · -55℃~+125℃· 153FBGA |
YMDL032MNS-S |
GJB-STD | 32GB · pSLC · -55℃~+125℃· 153FBGA |
YMDL064MNS-S |
GJB-STD | 64GB · pSLC · -55℃~+125℃· 153FBGA |
Cross-references
Vendor families for BOM exploration. Always validate ball map, speed bin, and temperature grade on your host.
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
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ISO 9001:2015 certified (GB/T 19001-2016)
Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
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Conforms to GJB 9001C—2017
Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Environmental methods (GJB-STD)
For Extreme-temp / GJB-STD SKUs, environmental planning and screening reference the following methods. This is not a claim of third-party product certification under these standards.
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GJB 150A (aligned with MIL-STD-810 methods)
Military equipment laboratory environmental test methods. GJB-STD SKUs are designed and screened with reference to GJB 150A; it is the Chinese military counterpart commonly mapped to MIL-STD-810 style environmental methods.
Product & interface standards
This catalog SKU follows the industry specifications that define its form factor and host interface.
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Industry SSD host interfaces
Host interface, command set, and form-factor behavior follow the applicable SATA, NVMe, or eMMC specification listed on the datasheet.
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JEDEC eMMC
Embedded MultiMediaCard devices conform to the JEDEC eMMC specification revision listed on the datasheet (for example eMMC 5.1).
Grade wording: Product grade definition.
Key highlights
Military-spec Embedded Storage Solution
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Encapsulates NAND flash
memory chips and controller in a single BGA, compact in size
-
Complies with the eMMC 5.1
standard supports I2-wire bus (CLK, CMD, data strobe, data bus and RST_n)
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Clock speed up to 400MHz
supports Single Data Rate (SDR) and Double Data Rate (DDR), with optional bus width of 1-bit/4-bit/8-bit
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Operating temperature range
−55℃~+125℃, low power consumption and low heat generation, suitable for portable and embedded devices
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Compatible with high-quality
platforms such as Loongson, Phytium, Rockchip, etc., and compatible with Micron series product MTFCXXGJDDQ-4M
Typical applications
Embedded Scenario Validation
Rugged Handheld Devices
Applied to rugged handheld devices, pSLC technology ensures data reliability, and low-power design extends device battery life.
- High Reliability with pSLC Technology
- Low Power Consumption for Extended Battery Life
- Compatible with High-Quality Platforms
Embedded Systems
Used in embedded systems, it features strong compatibility with the eMMC 5.1 standard and ultra-wide temperature operation to adapt to harsh environments.
- Strong Compatibility with eMMC 5.1 Standard
- Ultra-Wide Temperature Range for Harsh Environments
- Compatible with Micron Series Products
Series
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Industrial eMMC
Industrial eMMC managed NAND.
Engineering guides
-
eMMC vs NVMe BGA SSD: A Practical Guide for Industrial Embedded Storage Decisions
Say you are putting together an embedded system — an industrial controller, an IoT gateway, maybe a ruggedized computer. Processor picked, p...
-
eMMC vs UFS in Industrial Storage Architectures: Protocol Differences and Design Trade-offs
For years, eMMC (embedded MultiMediaCard) has been the go to embedded storage for cost sensitive and moderate performance industrial applica...
-
Integrating Industrial eMMC 5.1 in Embedded Systems: A Practical Guide
Industrial eMMC 5.1 combines NAND flash with a controller that handles ECC, wear leveling, and bad block management, simplifying system desi...
-
Industrial eMMC 5.1 Storage Guide
Industrial eMMC 5.1 overview — managed NAND, endurance modes, and BOM considerations for solder-down designs.
Product grade definition
What "GJB-standard" means on this website
How we use this label on our site: reliability tier, documentation, and use-case boundaries.
On this website, "GJB-standard" refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.
Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).
GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product's technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).