eMMC pSLC
eMMC 5.1 Standard · Ultra-wide Temperature Range: -55℃~105℃ · FBGA153 Package
Military-spec eMMC pSLC Storage Chip integrates NAND flash chips and controller in a single BGA package, complies with the eMMC 5.1 standard, features a clock speed of up to 400MHz, supports wide-temperature operation ranging from -55℃ to 105℃, and is compatible with Chinese platforms including Loongson, Phytium, Rockchip, etc.
Product Features
Military-spec Embedded Storage Solution
Technological Advantages
Military-spec Embedded Storage Solution
eMMC 5.1 Standard, High Compatibility
pSLC Technology, High Reliability
Ultra-wide Operating Temperature Range: -55℃~105℃
Compatible with High-quality Platforms Such as Loongson and Phytium
Specifications
Detailed Technical Specifications
Product Specifications
- Interface Standard
- eMMC 5.1
- Package Type
- FBGA153
- Physical Dimensions
- 11.5mm×13.0mm×1.0mm
- Capacity Options
- 8GB/16GB/32GB/64GB
- Operating Temperature
- -55℃~105℃
- Storage Temperature
- -45℃~90℃
- Supply Voltage
- Dual Voltage of 3.3V/1.8V
- Flash Type
- pSLC
- Clock Speed
- Up to 400MHz
- Transfer Mode
- Supports Single Data Rate (SDR) and Double Data Rate (DDR)
- Bus Width
- 1-bit/4-bit/8-bit Optional
- Compatible Platforms
- Compatible with high-quality platforms such as Loongson, Phytium, Rockchip, etc.
- Alternative Models
- Compatible with Micron series product MTFCXXGJDDQ-4M
- Warranty Period
- 5-Year Warranty Service
Part Numbers
Orderable Part Numbers
Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.
| Part Number | Grade | Specification |
|---|---|---|
| YMDL008MNS-S | Ind Ext | 8GB · pSLC · FBGA153 · −55~105°C |
| YMDL016MNS-S | Ind Ext | 16GB · pSLC · FBGA153 · −55~105°C |
| YMDL032MNS-S | Ind Ext | 32GB · pSLC · FBGA153 · −55~105°C |
| YMDL064MNS-S | Ind Ext | 64GB · pSLC · FBGA153 · −55~105°C |
Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.
Application Cases
Embedded Scenario Validation
Rugged Handheld Devices
Applied to rugged handheld devices, pSLC technology ensures data reliability, and low-power design extends device battery life.
Application Effects
- High Reliability with pSLC Technology
- Low Power Consumption for Extended Battery Life
- Compatible with High-Quality Platforms
Embedded Systems
Used in embedded systems, it features strong compatibility with the eMMC 5.1 standard and ultra-wide temperature operation to adapt to harsh environments.
Application Effects
- Strong Compatibility with eMMC 5.1 Standard
- Ultra-Wide Temperature Range for Harsh Environments
- Compatible with Micron Series Products
What “Military-spec” means on this website
How we use this label on our site — reliability tier, documentation, and use-case boundaries.
On this website, “Military-spec” refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.
Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).
GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product’s technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).
Important: “Military-spec” does not mean the products are marketed as dedicated for military end-use, and it does not imply government endorsement or inclusion on any procurement qualified list, unless separately documented on a dedicated page with authoritative evidence.
Customers are responsible for ensuring lawful procurement and use under applicable laws and regulations.
Related technical resources
Related products
NAND Flash
Military-spec NAND Flash memory chips compliant with ONFI 4.0. TLC type with up to 3000 program/erase cycles, I/O speed up to 800 MB/s, and wide-temperature operation from -40°C to +85°C with enhanced reliability validation for rugged embedded applications.
8Gb DDR4 DRAM Chip (-55°C to +105°C)
High-quality 8Gb DDR4 DRAM chip, based on high-quality original Jinyuan dies, undergo packaging, testing and wide-temperature screening, making them compatible with industrial and specialized scenarios. With an operating frequency of 3200MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and include documented cross-reference for select Micron FBGA78/FBGA96 industrial part numbers — verify pin map and speed grade with our datasheet before qualification
DDR3 DRAM Chip (-55°C to +105°C)
High-quality DDR3 memory chips are based on high-quality original JinYuan dies. Their packaging, testing and wide-temperature screening comply with high-standard specifications. Featuring an operating frequency of 800MHz or 933MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and offer JEDEC-aligned cross-reference for select incumbent part numbers — verify with our datasheet and BOM review before qualification.
Need application engineering or a custom storage solution?
Our engineers help with BOM review, compatibility validation, and storage selection for your project.