DRAM Wide-temp

Industrial DDR5 DRAM

Wide-temperature DDR5 DRAM chips.

Series overview

Industrial DDR5 serves next-generation edge compute, industrial servers, and AI gateways that need higher bandwidth with wide-temp coverage. Loongtion’s 16Gb DDR5 monolithic line (WBGA-82 ×8) targets programs that cannot rely on consumer DDR5 modules in sealed or fanless enclosures. Early industrial DDR5 designs often inherit consumer speed bins — this series exists so temperature grade and supply commitments match industrial qualification, not only peak MT/s marketing numbers. Browse the product cards for active densities and grades; request the datasheet early because DDR5 training margins vary by SoC vendor.

Technical points to align

Compare density (16Gb), organization (×8), package/ball map, speed bin (4800/5600/6400 MT/s class), 1.1V domain, and temperature grade. Many consumer-leaning Samsung bins start at 0°C; Loongtion industrial grades emphasize −40°C to +85°C. Functional alternatives to Micron MT60B2G8HB* and related families require host training validation — treat as engineering guidance, not a blanket swap warranty. Always re-run device training and stress across the full ambient range of the enclosure. Power integrity and PMIC interaction matter more on DDR5 than on DDR4; involve the board power team when changing brands mid-program.

How to select in this series

If you have a foreign PN, start at cross-reference. Otherwise shortlist by speed bin and temperature on the product cards below, then request fit review. Background: industrial DDR5 selection guide. For platforms still on DDR4, compare DDR4 series before planning a controller change. Memory-chip hub context: industrial memory chips hub. Contact engineering when the SoC vendor has a qualified memory list — Loongtion can align documentation for dual-source reviews.

Need a custom configuration?

Firmware, temperature screen, silk-screen, or a full custom storage design — talk to application engineering.

Contact engineering