Pin-to-Pin Compatible Replacement Legacy / EOL path Micron

Micron MT41K128M16JT-125IT:K Replacement - Loongtion Pin-to-Pin Compatible

Pin-to-Pin Compatible Replacement for Micron MT41K128M16JT-125IT:K — parameter alignment for BOM review, why evaluate Loongtion, FAQs, and datasheet and quote paths. Qualify on your board before swap.

Vendor PN Micron MT41K128M16JT-125IT:K

Also listed as MT41K128M16JT-125IT

Loongtion PN Loongtion YZ38E16SBB-9MFB-M(O) / YZ38E16SBB-9MFB-M

Pin-to-Pin Compatible · Replacement

Summary

2Gb DDR3 DRAM, 128M×16, FBGA96, −40°C to +85°C (M(O)) or −55°C to +125°C GJB (M) — handbook Equivalent Foreign Model.

Parameter alignment

Key handbook fields side by side — confirm package, grade, and firmware against the datasheet for your build.

Parameter Loongtion Micron
Density 2Gb (128M×16) 2Gb (128M×16)
Package FBGA96 (13×9×1.2 mm) FBGA96
Speed 800/933 MHz DDR3-125 (verify)
Voltage 1.35V / 1.5V 1.35V / 1.5V
Temperature −40~+85°C (M(O)) / −55~+125°C GJB (M) Industrial wide-temp (verify grade)

Why evaluate Loongtion for this PN

Cross-reference is not only for discontinued parts — many OEMs qualify a Loongtion path as a second source next to Micron, then use it for dual-sourcing, allocation relief, or future EOL coverage.

  • Keep long-lifecycle boards alive When Micron MT41K128M16JT-125IT:K is hard to source or marked EOL, a documented Loongtion path helps MRO and long-life OEM programs avoid a full redesign — after board qualification.
  • Pin-to-Pin Compatible path for BOM review This page documents the Loongtion PN, key parameter alignment, and compatibility type. Treat it as engineering guidance — confirm package, speed/firmware, and temperature on your host before production.
  • Industrial temperature grades where listed Loongtion lists −40~+85°C (M(O)) / −55~+125°C GJB (M) for this line. Match the ordering PN to your environmental requirement (commercial, wide-temp, or Extreme-temp / GJB where offered).
  • Direct engineering and small-batch pilots Request the datasheet with your incumbent PN, board, and temperature grade. Typical engineering reply is within one business day on China business days — useful for pilots before you lock an AVL dual-source.

Typical applications

Common equipment contexts where engineers search for this part family or a compatible alternative.

  • Industrial PLC / DCS controllers
  • CNC and motion controllers
  • Industrial PCs and HMIs
  • Long-lifecycle embedded boards
  • Medical and test equipment (where grade allows)

FAQs for this cross-reference

Is MT41K128M16JT-125IT:K a pin-to-pin replacement available from Loongtion?

Yes — this page documents a Pin-to-Pin Compatible path from Micron MT41K128M16JT-125IT:K to Loongtion YZ38E16SBB-9MFB-M(O) / YZ38E16SBB-9MFB-M. Treat it as engineering guidance for BOM shortlisting; qualify package, speed bin, voltage, and temperature on your board before production swap.

Is this only for discontinued parts?

This mapping is especially useful when the incumbent is EOL or allocation-constrained, but the same qualification path also supports dual-sourcing while supply still exists.

Do I need to redesign the PCB or update BIOS/firmware?

For documented pin-to-pin mappings, the ball / pin map is intended to match the incumbent. Still verify speed grade, voltage (e.g. DDR3 vs DDR3L), timing, and any controller training or BIOS memory tables on your specific host before volume release.

What temperature grades can I order?

Loongtion lists −40~+85°C (M(O)) / −55~+125°C GJB (M) for this line. Confirm the exact ordering PN (industrial vs Extreme-temp / GJB where offered) against your environmental requirement and datasheet.

Can I request the datasheet?

Yes. Use Contact engineering on this page with the incumbent PN (MT41K128M16JT-125IT:K), target board, temperature grade, and quantity. We typically reply within one business day on China business days.

Related Loongtion products

Open a product page for specs, documents, and inquiry.

DDR3 DRAM Chip · Extreme · CN DRAM — FBGA96 · ×16 · CN supply View → DDR3 DRAM Chip · Wide-temp · CN DRAM — Reliable DDR3 with industrial manufacturing View →

Related technical resources

Guides and notes that help qualify replacement, layout, and temperature choices.

DDR3 Legacy Replacement: A Field Engineer's Guide Guide Read → Industrial DDR3 Memory Selection Guide Whitepaper Read → Loongtion DDR3 DRAM chip: Integration and Selection Guide Guide Read → DDR3 vs DDR4 in Industrial Systems: Supply Chain Risks and Long-Term Design Reliability Article Read →

Related cross-references

Other published mappings in the same product family.

Vendor Vendor PN Loongtion PN
Micron MT41K256M16HA-125IT YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
ChangXin (CXMT) CXD2A8G8MA YZ38G16SDB-9INN-M(0) (8Gb ×16 FBGA96)
Samsung K4B4G1646Q-HYK0 YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
ISSI IS43TR16256BL-125KBLI YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
SK hynix H5TQ4G63CFR-RDC YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
Samsung K4B8G1646D-MCNB YZ38G16SDB-9INN-M(0) (8Gb ×16 FBGA96)

Source: 2026 product handbook §2 DDR3 — Equivalent Foreign Model column.

All manufacturer names, logos, and part numbers (such as Micron, Samsung, SK hynix, Phison, Kontron, Silicon Motion, and others) used on this website are for cross-reference and identification purposes only. These trademarks remain the property of their respective owners. Loongtion is not an authorized distributor or affiliate of these manufacturers.

Need help qualifying this pin-to-pin replacement?

Share the incumbent PN, target board, and temperature grade — we respond within one business day on China business days (Mon–Fri, UTC+8; excl. public holidays).

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