DDR3 DRAM Chip · Wide-temp · CN
Reliable DDR3 with industrial manufacturing
Key facts
What industrial buyers usually need to know first — before diving into the full datasheet.
5-year supply · 12-month EOL notice
Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.
MOQ from 1 pc
Prototype and repair lots without large inventory lock-in — then scale to production.
BOM review & firmware fit
We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.
5-year warranty · 4–8 weeks lead time
Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.
| MOQ | From 1 pc |
|---|---|
| Standard lead time | 4–8 weeks (typical; confirm with sales for your configuration) |
| Warranty | 5 years (see /warranty for tier details) |
| Supply commitment | Minimum 5 years for qualified SKUs · 12-month EOL notice |
| Engineering support | BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request |
| Samples | Available on request |
Overview
Based on high-quality Industrial DDR3 memory chips from original manufacturer Jinyuan, through wide-temperature screening and customized packaging and testing, it features medium-to-high quality and is compatible with industrial embedded systems and Industrial devices.
Specifications
| Interface | SSTL (DDR3) |
|---|---|
| Package | FBGA96 |
| Capacity Configuration | 128Mb×16(2Gb)/256Mb×16(4Gb)/512Mb×16(8Gb) |
| Operating temperature | -40℃~+85℃ |
| Storage temperature | -45℃~+90℃ |
| Operating Frequency | 800MHz/933MHz |
| Power Supply Support | 1.35V/1.5V Dual Voltage |
| Bus Width | x8/x16 |
| Replaceable Models | Can directly replace equivalent models from Micron, Samsung, etc. |
| Warranty Period | 5 years |
Orderable part numbers
Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.
| Part number | Grade | Summary |
|---|---|---|
YZ38E16SBB-9MFB-M |
GJB-STD | 2Gb · -55℃~+125℃· xref MT41K128M16JT-125IT:K |
YZ38E16SBB-9MFB-M(O) |
Wide-temp | 2Gb · -40℃~+85℃· xref MT41K128M16JT-125IT:K |
YZ38F16SBB-9MFD-M |
GJB-STD | 4Gb · -55℃~+125℃· xref MT41K256M16HA-125IT |
YZ38F16SBB-9MFD-M(O) |
Wide-temp | 4Gb · -40℃~+85℃· xref MT41K256M16HA-125IT |
YZ38G16SDB-9INN-M(0) |
Wide-temp | 8Gb · 512Mb×16 · FBGA96 · −40~+85°C Industrial (datasheet; not in 2026 PDF table) |
Cross-references
Vendor families for BOM exploration. Always validate ball map, speed bin, and temperature grade on your host.
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
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ISO 9001:2015 certified (GB/T 19001-2016)
Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
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Conforms to GJB 9001C—2017
Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Product & interface standards
This catalog SKU follows the industry specifications that define its form factor and host interface.
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JEDEC DRAM specifications
DDR3 / DDR4 / DDR5 / LPDDR families follow applicable JEDEC device and signaling specifications for the listed density, organization, and speed bin.
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JEDEC DDR SDRAM
DDR3 / DDR4 / DDR5 devices follow applicable JEDEC DDR specifications for the listed density, organization, and speed bin.
Grade wording: Product grade definition.
Key highlights
High-grade Industrial DDR3 DRAM Chip
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Both Wafer and Packaging &
Testing Are of High Quality
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Standard SSTL Interface
FBGA96 Package, Operating Frequency 800MHz/933MHz, Bus Width x8/x16
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Wide Temperature Operation
from -40℃ to +85℃, Storage Temperature from -45℃ to +90℃, Passed Industrial Stability Test
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Supports Dual Voltages
of 1.35V/1.5V Directly Replaceable with Equivalent Models from Micron, Samsung, etc.
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Configurations
(128Mb×16~512Mb×16) Corresponding to Capacities of 2Gb~8Gb, Meeting the Memory Requirements of Industrial Equipment
Typical applications
Industrial DDR3 DRAM chips for legacy embedded designs, domestic supply programs and wide-temperature control systems.
High-Quality Industrial Control Computer Memory
Applied to industrial control computers.
- High frequency boosts system performance
High-Quality Device for Replacing Micron MT41J64M16GJT Series
Used to replace the Micron MT41J64M16GJT series to achieve high-quality substitution.
- Replaceable with the same model of Micron
- Compatible with the original system design
- High quality meets compliance requirements
Series
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Industrial DDR3 DRAM
Wide-temperature DDR3 DRAM chips for embedded platforms.
Engineering guides
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Industrial Temperature Grades: An Engineering Guide to -40, -55, and Beyond
A practical engineering guide to industrial temperature grades: what -40°C~+85°C and -55°C~+105°C ratings actually mean, how they are tested...
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Samsung K4A8G165WC-BCWE Replacement: Loongtion DDR4 Wide-Temperature Cross-Reference
Samsung K4A8G165WC DDR4 replacement? Compare package, data rate and temperature grade with Loongtion YZ48G08V / YZ48G16V wide-temp parts.
-
DDR3 Legacy Replacement: A Field Engineer's Guide
Field checklist for keeping long-life industrial DDR3 boards alive — package, organization, voltage, speed bin, and temperature grade — with...
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Migrating from DDR3 to DDR5: A Design-First Integration Framework for Industrial Systems
Industrial system architects rarely have the luxury of designing a single product generation in isolation. A typical PLC or edge gateway pla...
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Multi-Generational DRAM BOM Strategies: Balancing DDR3, DDR4, and DDR5 in Long-Life Industrial Designs
Industrial equipment such as PLCs, HMIs, and embedded controllers often have production lifecycles exceeding ten years. A product designed t...
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DDR3 vs DDR4 in Industrial Embedded Systems: A Performance Trade-off Analysis for Migration Decisions
When Migration from DDR3 to DDR4 Makes Sense (and When It Doesn't)Industrial embedded system designers face a recurring dilemma: stick with...
