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DDR3 DRAM Chip

High-Quality Manufacturing · Operating Temperature -40℃~+85℃

Based on high-quality Industrial DDR3 memory chips from original manufacturer Jinyuan, through wide-temperature screening and customized packaging and testing, it features medium-to-high quality and is compatible with industrial embedded systems and Industrial devices.

Operating Temperature
-40℃~+85℃
Capacity Range
2Gb-8Gb
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DDR3 DRAM Chip — product image
Product Features

Designed exclusively for industrial embedded systems and industrial equipment

High-grade Industrial DDR3 DRAM Chip

1

Both Wafer and Packaging & Testing Are of High Quality

2

Standard SSTL Interface, FBGA96 Package, Operating Frequency 800MHz/933MHz, Bus Width x8/x16

3

Wide Temperature Operation from -40℃ to +85℃, Storage Temperature from -45℃ to +90℃, Passed Industrial Stability Test

4

Supports Dual Voltages of 1.35V/1.5V, Directly Replaceable with Equivalent Models from Micron, Samsung, etc.

5

Configurations (128Mb×16~512Mb×16) Corresponding to Capacities of 2Gb~8Gb, Meeting the Memory Requirements of Industrial Equipment

Technical Advantages

Robust Industrial Storage Technology

High-Requirement DDR3 Memory Solution

1

Designed for High-Demand Environments

2

Can Replace Same Models of Micron and Samsung

3

Supports 1.35V/1.5V Dual Voltages

4

Passed Industrial Stability Tests

Technical Specifications

Detailed Technical Specifications

Complete Specifications of Industrial DDR3 DRAM Chip

Product Specifications

Interface Type
SSTL (DDR3)
Package Type
FBGA96
Capacity Configuration
128Mb×16(2Gb)/256Mb×16(4Gb)/512Mb×16(8Gb)
Operating Temperature
-40℃~+85℃
Storage Temperature
-45℃~+90℃
Operating Frequency
800MHz/933MHz
Power Supply Support
1.35V/1.5V Dual Voltage
Bus Width
x8/x16
Replaceable Models
Can directly replace equivalent models from Micron, Samsung, etc.
Warranty Period
5 years

Part Numbers

Orderable Part Numbers

Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.

Part Number Grade Specification
YZ38E16SBB-9MFB-M Ind Ext 2Gb · 128Mb×16 · FBGA96 · −55~105°C
YZ38E16SBB-9MFB-M(0) Ind WT 2Gb · 128Mb×16 · FBGA96 · −40~85°C
YZ38F16SBB-9MFD-M Ind Ext 4Gb · 256Mb×16 · FBGA96 · −55~105°C
YZ38F16SBB-9MFD-M(0) Ind WT 4Gb · 256Mb×16 · FBGA96 · −40~85°C
YZ38G16SDB-9INN-M(0) Ind WT 8Gb · 512Mb×16 · FBGA96 · −40~85°C

Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.

Application Cases

Typical Application Scenarios

Industrial DDR3 DRAM chips for legacy embedded designs, domestic supply programs and wide-temperature control systems.

1

High-Quality Industrial Control Computer Memory

Applied to industrial control computers.

Application Effects

  • High frequency boosts system performance
2

High-Quality Device for Replacing Micron MT41J64M16GJT Series

Used to replace the Micron MT41J64M16GJT series to achieve high-quality substitution.

Application Effects

  • Replaceable with the same model of Micron
  • Compatible with the original system design
  • High quality meets compliance requirements

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