DDR3 DRAM Chip (-55°C to +105°C)
Ultra-wide Temperature Range -55℃~105℃ · FBGA96 Package
High-quality DDR3 memory chips are based on high-quality original JinYuan dies. Their packaging, testing and wide-temperature screening comply with high-standard specifications. Featuring an operating frequency of 800MHz or 933MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and offer JEDEC-aligned cross-reference for select incumbent part numbers — verify with our datasheet and BOM review before qualification.
Product Features
Military-spec High-quality Memory Solution
Technical Advantages
Military-spec Highly Reliable Storage Solution
High Quality
Replaceable with Micron, Samsung and Other Components
Ultra-wide Operating Temperature Range: -55℃~105℃
Complies with GJB7400 N1 Specification Requirements
Specifications
Detailed Technical Specifications
Product Specifications
- Interface Type
- DDR3 SSTL
- Package Type
- FBGA96
- Physical Dimensions
- 9mm×13.0mm×1.2mm
- Capacity Configuration
- 128Mb×16(2Gb)/256Mb×16(4Gb)
- Operating Temperature
- -55℃~105℃
- Storage Temperature
- -45℃~90℃
- Operating Frequency
- 800MHz/933MHz
- Bus Width
- x16
- Supply Voltage
- 1.35V/1.5V Dual Voltage
- Reliability Standard
- Complies with GJB7400 N1 specification requirements
- Replaceable Models
- Replaceable with corresponding devices from Micron, Samsung, etc.
- Warranty Period
- 5-year warranty service
Part Numbers
Orderable Part Numbers
Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.
| Part Number | Grade | Specification |
|---|---|---|
| YZ38E16SBB-9MFB-M | Ind Ext | 2Gb · 128Mb×16 · FBGA96 · −55~105°C |
| YZ38E16SBB-9MFB-M(0) | Ind WT | 2Gb · 128Mb×16 · FBGA96 · −40~85°C |
| YZ38F16SBB-9MFD-M | Ind Ext | 4Gb · 256Mb×16 · FBGA96 · −55~105°C |
| YZ38F16SBB-9MFD-M(0) | Ind WT | 4Gb · 256Mb×16 · FBGA96 · −40~85°C |
| YZ38G16SDB-9INN-M(0) | Ind WT | 8Gb · 512Mb×16 · FBGA96 · −40~85°C |
Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.
Application Cases
Military-spec DDR3 DRAM chips for avionics, vehicle electronics and defense embedded systems requiring -55°C to +105°C operation.
Industrial Embedded Systems
Applied in industrial embedded systems, featuring high quality that meets high reliability requirements, and ultra-wide temperature operation to adapt to harsh environments.
Application Effects
- High Quality and High Reliability
- Ultra-wide Temperature Operation Adaptable to Harsh Environments
- Compliant with GJB7400 N1 Specification
Special-purpose Computing Equipment
Used in special-purpose computing equipment, replaceable with corresponding components from Micron, Samsung, etc.
Application Effects
- Replaceable with Micron and Samsung Components
- High Stability Ensures Continuous Operation
What “Military-spec” means on this website
How we use this label on our site — reliability tier, documentation, and use-case boundaries.
On this website, “Military-spec” refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.
Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).
GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product’s technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).
Important: “Military-spec” does not mean the products are marketed as dedicated for military end-use, and it does not imply government endorsement or inclusion on any procurement qualified list, unless separately documented on a dedicated page with authoritative evidence.
Customers are responsible for ensuring lawful procurement and use under applicable laws and regulations.
Related technical resources
- Whitepaper Industrial DDR3 Memory Selection Guide Engineering guide for selecting industrial-grade DDR3 DRAM chips for embedded and rugged applications.
- Article DDR3 vs DDR4 in Industrial Embedded Systems: A Performance Trade-off Analysis for Migration Decisions Compare DDR3 and DDR4 for industrial embedded designs: bandwidth, latency, power, density, and reliability features. A decision framework for when to upgrade or stay with DDR3.
- Technical Guide Loongtion DDR3 DRAM chip: Integration and Selection Guide A practical guide to selecting and integrating Loongtion DDR3 DRAM chip components for industrial embedded designs, covering product variants, electrical characteristics, and system design considerations.
Related products
NAND Flash
Military-spec NAND Flash memory chips compliant with ONFI 4.0. TLC type with up to 3000 program/erase cycles, I/O speed up to 800 MB/s, and wide-temperature operation from -40°C to +85°C with enhanced reliability validation for rugged embedded applications.
8Gb DDR4 DRAM Chip (-55°C to +105°C)
High-quality 8Gb DDR4 DRAM chip, based on high-quality original Jinyuan dies, undergo packaging, testing and wide-temperature screening, making them compatible with industrial and specialized scenarios. With an operating frequency of 3200MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and include documented cross-reference for select Micron FBGA78/FBGA96 industrial part numbers — verify pin map and speed grade with our datasheet before qualification
eMMC pSLC
Military-spec eMMC pSLC Storage Chip integrates NAND flash chips and controller in a single BGA package, complies with the eMMC 5.1 standard, features a clock speed of up to 400MHz, supports wide-temperature operation ranging from -55℃ to 105℃, and is compatible with Chinese platforms including Loongson, Phytium, Rockchip, etc.
Need application engineering or a custom storage solution?
Our engineers help with BOM review, compatibility validation, and storage selection for your project.