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DDR3 DRAM Chip (-55°C to +105°C)

Ultra-wide Temperature Range -55℃~105℃ · FBGA96 Package

High-quality DDR3 memory chips are based on high-quality original JinYuan dies. Their packaging, testing and wide-temperature screening comply with high-standard specifications. Featuring an operating frequency of 800MHz or 933MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and offer JEDEC-aligned cross-reference for select incumbent part numbers — verify with our datasheet and BOM review before qualification.

Operating Temperature
-55℃~105℃
Capacity Range
2Gb-4Gb
DDR3 DRAM Chip (-55°C to +105°C) — product image
Product Features

Product Features

Military-spec High-quality Memory Solution

1

High Quality, based on high-quality original wafers, packaging testing and wide-temperature screening meet the requirements of Industrial and specialized scenarios

2

Standard SSTL interface, operating frequency 800MHz or 933MHz, bit width x16

3

Operating temperature -55℃~105℃, storage temperature -45℃~90℃, high stability

4

Replaceable with corresponding devices from Micron, Samsung, etc., compliant with GJB7400 N1 specification requirements

5

Dual voltage support for 1.35V/1.5V

Technical Advantages

Technical Advantages

Military-spec Highly Reliable Storage Solution

1

High Quality

2

Replaceable with Micron, Samsung and Other Components

3

Ultra-wide Operating Temperature Range: -55℃~105℃

4

Complies with GJB7400 N1 Specification Requirements

Technical Specifications

Specifications

Detailed Technical Specifications

Product Specifications

Interface Type
DDR3 SSTL
Package Type
FBGA96
Physical Dimensions
9mm×13.0mm×1.2mm
Capacity Configuration
128Mb×16(2Gb)/256Mb×16(4Gb)
Operating Temperature
-55℃~105℃
Storage Temperature
-45℃~90℃
Operating Frequency
800MHz/933MHz
Bus Width
x16
Supply Voltage
1.35V/1.5V Dual Voltage
Reliability Standard
Complies with GJB7400 N1 specification requirements
Replaceable Models
Replaceable with corresponding devices from Micron, Samsung, etc.
Warranty Period
5-year warranty service

Part Numbers

Orderable Part Numbers

Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.

Part Number Grade Specification
YZ38E16SBB-9MFB-M Ind Ext 2Gb · 128Mb×16 · FBGA96 · −55~105°C
YZ38E16SBB-9MFB-M(0) Ind WT 2Gb · 128Mb×16 · FBGA96 · −40~85°C
YZ38F16SBB-9MFD-M Ind Ext 4Gb · 256Mb×16 · FBGA96 · −55~105°C
YZ38F16SBB-9MFD-M(0) Ind WT 4Gb · 256Mb×16 · FBGA96 · −40~85°C
YZ38G16SDB-9INN-M(0) Ind WT 8Gb · 512Mb×16 · FBGA96 · −40~85°C

Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.

Application Cases

Application Cases

Military-spec DDR3 DRAM chips for avionics, vehicle electronics and defense embedded systems requiring -55°C to +105°C operation.

1

Industrial Embedded Systems

Applied in industrial embedded systems, featuring high quality that meets high reliability requirements, and ultra-wide temperature operation to adapt to harsh environments.

Application Effects

  • High Quality and High Reliability
  • Ultra-wide Temperature Operation Adaptable to Harsh Environments
  • Compliant with GJB7400 N1 Specification
2

Special-purpose Computing Equipment

Used in special-purpose computing equipment, replaceable with corresponding components from Micron, Samsung, etc.

Application Effects

  • Replaceable with Micron and Samsung Components
  • High Stability Ensures Continuous Operation
Product grade definition

What “Military-spec” means on this website

How we use this label on our site — reliability tier, documentation, and use-case boundaries.

On this website, “Military-spec” refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.

Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).

GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product’s technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).

Important: “Military-spec” does not mean the products are marketed as dedicated for military end-use, and it does not imply government endorsement or inclusion on any procurement qualified list, unless separately documented on a dedicated page with authoritative evidence.

Customers are responsible for ensuring lawful procurement and use under applicable laws and regulations.

NAND Flash — product image
Memory Chips

Military-spec NAND Flash memory chips compliant with ONFI 4.0. TLC type with up to 3000 program/erase cycles, I/O speed up to 800 MB/s, and wide-temperature operation from -40°C to +85°C with enhanced reliability validation for rugged embedded applications.

8Gb DDR4 DRAM Chip (-55°C to +105°C) — product image
Memory Chips

High-quality 8Gb DDR4 DRAM chip, based on high-quality original Jinyuan dies, undergo packaging, testing and wide-temperature screening, making them compatible with industrial and specialized scenarios. With an operating frequency of 3200MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and include documented cross-reference for select Micron FBGA78/FBGA96 industrial part numbers — verify pin map and speed grade with our datasheet before qualification

eMMC pSLC — product image
Memory Chips

Military-spec eMMC pSLC Storage Chip integrates NAND flash chips and controller in a single BGA package, complies with the eMMC 5.1 standard, features a clock speed of up to 400MHz, supports wide-temperature operation ranging from -55℃ to 105℃, and is compatible with Chinese platforms including Loongson, Phytium, Rockchip, etc.

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