Functional Alternative Alternative Legacy / EOL path Samsung

Samsung K4B4G1646Q-HYK0 Alternative - Loongtion Functional Alternative

Functional Alternative Alternative for Samsung K4B4G1646Q-HYK0 — parameter alignment for BOM review, why evaluate Loongtion, FAQs, and datasheet and quote paths. Qualify on your board before swap.

Vendor PN Samsung K4B4G1646Q-HYK0

Also listed as K4B4G1646Q, K4B4G1646, Samsung DDR3 4Gb

Loongtion PN Loongtion YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M

Functional Alternative · Alternative

Summary

Samsung 4Gb DDR3L/DDR3 ×16 in 96-ball FBGA — verified public datasheet (K4B4G1646Q). Loongtion 4Gb FBGA96 path is for BOM exploration when Samsung DDR3 is EOL/hard to source. Package body size and ball map must be confirmed (not handbook Pin-to-Pin). Dual 1.35/1.5 V and speed bin must match the controller.

Parameter alignment

Key handbook fields side by side — confirm package, grade, and firmware against the datasheet for your build.

Parameter Loongtion Samsung
Density 4Gb (256M×16) 4Gb (256M×16)
Package FBGA96 (13×9×1.2 mm) 96-ball FBGA (verify body / ball map)
Voltage 1.35V / 1.5V 1.35V DDR3L / 1.5V DDR3
Temperature −40~+85°C / −55~+125°C GJB Commercial/IT grades (often 0~95°C case; verify)

Why evaluate Loongtion for this PN

Cross-reference is not only for discontinued parts — many OEMs qualify a Loongtion path as a second source next to Samsung, then use it for dual-sourcing, allocation relief, or future EOL coverage.

  • Keep long-lifecycle boards alive When Samsung K4B4G1646Q-HYK0 is hard to source or marked EOL, a documented Loongtion path helps MRO and long-life OEM programs avoid a full redesign — after board qualification.
  • Functional Alternative path for BOM review This page documents the Loongtion PN, key parameter alignment, and compatibility type. Treat it as engineering guidance — confirm package, speed/firmware, and temperature on your host before production.
  • Industrial temperature grades where listed Loongtion lists −40~+85°C / −55~+125°C GJB for this line. Match the ordering PN to your environmental requirement (commercial, wide-temp, or Extreme-temp / GJB where offered).
  • Direct engineering and small-batch pilots Request the datasheet with your incumbent PN, board, and temperature grade. Typical engineering reply is within one business day on China business days — useful for pilots before you lock an AVL dual-source.

Typical applications

Common equipment contexts where engineers search for this part family or a compatible alternative.

  • Industrial PLC / DCS controllers
  • CNC and motion controllers
  • Industrial PCs and HMIs
  • Long-lifecycle embedded boards
  • Medical and test equipment (where grade allows)

FAQs for this cross-reference

What does “Functional Alternative” mean for K4B4G1646Q-HYK0?

It means Loongtion YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M is a documented functional or form-factor path for BOM exploration versus Samsung K4B4G1646Q-HYK0 — not a blanket semiconductor interchangeability warranty. Confirm interface, package, capacity/density, firmware, and temperature on your host.

Can I use Loongtion as a second source while still buying Samsung?

Yes — that is a common international OEM pattern. Qualify the Loongtion PN on your board, keep Samsung as primary if required, and use Loongtion for allocation relief, cost/lead-time balance, or future EOL coverage.

What must I verify before substituting?

Match the critical interface and mechanical constraints (package / form factor, protocol, capacity, voltage, speed, endurance class). Then validate firmware behavior, power, and −40~+85°C / −55~+125°C GJB on the target platform.

Can I evaluate the part before ordering?

Send the incumbent PN, application, temperature grade, and quantity. Engineering will confirm the closest Loongtion PN, evaluation terms, and lead time.

Related Loongtion products

Open a product page for specs, documents, and inquiry.

DDR3 DRAM Chip · Extreme · CN DRAM — FBGA96 · ×16 · CN supply View → DDR3 DRAM Chip · Wide-temp · CN DRAM — Reliable DDR3 with industrial manufacturing View →

Related technical resources

Guides and notes that help qualify replacement, layout, and temperature choices.

DDR3 Legacy Replacement: A Field Engineer's Guide Guide Read → Industrial DDR3 Memory Selection Guide Whitepaper Read → Loongtion DDR3 DRAM chip: Integration and Selection Guide Guide Read → DDR3 vs DDR4 in Industrial Systems: Supply Chain Risks and Long-Term Design Reliability Article Read →

Related cross-references

Other published mappings in the same product family.

Vendor Vendor PN Loongtion PN
Micron MT41K128M16JT-125IT:K YZ38E16SBB-9MFB-M(O) / YZ38E16SBB-9MFB-M
Micron MT41K256M16HA-125IT YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
ChangXin (CXMT) CXD2A8G8MA YZ38G16SDB-9INN-M(0) (8Gb ×16 FBGA96)
ISSI IS43TR16256BL-125KBLI YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
SK hynix H5TQ4G63CFR-RDC YZ38F16SBB-9MFD-M(O) / YZ38F16SBB-9MFD-M
Samsung K4B8G1646D-MCNB YZ38G16SDB-9INN-M(0) (8Gb ×16 FBGA96)

Source: Verified: Samsung K4B4G1646Q datasheet listings (4Gb ×16, FBGA96). Functional alternative — not listed as Equivalent Foreign Model in Loongtion handbook.

All manufacturer names, logos, and part numbers (such as Micron, Samsung, SK hynix, Phison, Kontron, Silicon Motion, and others) used on this website are for cross-reference and identification purposes only. These trademarks remain the property of their respective owners. Loongtion is not an authorized distributor or affiliate of these manufacturers.

Need help qualifying this functional alternative?

Share the incumbent PN, target board, and temperature grade — we respond within one business day on China business days (Mon–Fri, UTC+8; excl. public holidays).

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