8Gb DDR4 DRAM Chip · Wide-temp
High-performance DDR4 for industrial systems
Key facts
What industrial buyers usually need to know first — before diving into the full datasheet.
5-year supply · 12-month EOL notice
Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.
MOQ from 1 pc
Prototype and repair lots without large inventory lock-in — then scale to production.
BOM review & firmware fit
We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.
5-year warranty · 4–8 weeks lead time
Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.
| MOQ | From 1 pc |
|---|---|
| Standard lead time | 4–8 weeks (typical; confirm with sales for your configuration) |
| Warranty | 5 years (see /warranty for tier details) |
| Supply commitment | Minimum 5 years for qualified SKUs · 12-month EOL notice |
| Engineering support | BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request |
| Samples | Available on request |
Overview
Industrial DDR4 memory chips based on high-quality wafers from original manufacturers, which have undergone Industrial packaging and testing and wide-temperature optimization, boast high quality and are compatible with industrial embedded systems and high-end computing devices.
Specifications
| Interface | SSTL (DDR4) |
|---|---|
| Package | FBGA78/FBGA96 |
| Capacity Configuration | 256Mb×16(4Gb)/512Mb×16(8Gb)/1Gb×8(8Gb)/2Gb×8(16Gb) |
| Operating temperature | -40℃~+85℃ |
| Storage temperature | -45℃~+90℃ |
| Operating Frequency | 3200MHz |
| VDD = VDDQ | 1.2V +/- 0.06V |
| Bus Width | x8/x16 |
| Nominal Capacity | All 8Gb |
| Replaceable Models | Replaceable with corresponding models from Micron, Samsung, ChangXin, etc. |
| Warranty Period | 5 Years |
Orderable part numbers
Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.
| Part number | Grade | Summary |
|---|---|---|
YZ48G08V-F7HPI-M |
Wide-temp | 8Gb · -40℃~+85℃· FBGA78 · xref MT40A1G8WE-075EAIT:B |
YZ48G08V-F7HPI-M(O) |
Wide-temp | 8Gb · -40℃~+85℃· FBGA78 · xref MT40A1G8WE-075EAIT:B |
YZ48G16V-F9HPI-M |
Wide-temp | 8Gb · -40℃~+85℃· FBGA96 · xref MT40A512M16JY-07EAIT:B |
YZ48G16V-F9HPI-M(O) |
Wide-temp | 8Gb · -40℃~+85℃· FBGA96 · xref MT40A512M16JY-07EAIT:B |
Cross-references
Vendor families for BOM exploration. Always validate ball map, speed bin, and temperature grade on your host.
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
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ISO 9001:2015 certified (GB/T 19001-2016)
Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
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Conforms to GJB 9001C—2017
Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Product & interface standards
This catalog SKU follows the industry specifications that define its form factor and host interface.
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JEDEC DRAM specifications
DDR3 / DDR4 / DDR5 / LPDDR families follow applicable JEDEC device and signaling specifications for the listed density, organization, and speed bin.
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JEDEC DDR SDRAM
DDR3 / DDR4 / DDR5 devices follow applicable JEDEC DDR specifications for the listed density, organization, and speed bin.
Grade wording: Product grade definition.
Key highlights
High-Performance 8Gb DDR4 DRAM Chip, China Solution
-
Both wafer and package
are of high quality
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FBGA78/FBGA96 package
operating frequency 3200MHz, bit width x8/x16, nominal capacity 8Gb
-
Supports VDD(VDDQ) 1.2V +/-
0.06V replaceable with corresponding models of Micron, Samsung, ChangXin, etc.
-
Covers 256Mb×16~2Gb×8 (all
8Gb) compatible with memory designs of different industrial motherboards
Typical applications
Wide-temperature DDR4 for outdoor cabinets, vehicle electronics, industrial gateways and GCC extreme-heat field deployments.
High-Quality Industrial High-Performance Server Memory
Applied to high-quality Industrial high-performance servers, the 3200MHz high frequency enhances server performance.
- High frequency enhances server performance
High-Quality Industrial Device for Replacing ChangXin CXDQ Series
Used to replace ChangXin CXDQ series, achieving high-quality replacement and meeting the upgrade requirements of Industrial devices.
- Can replace ChangXin's equivalent models
- Compatible with original system design
- High quality guarantees supply chain security
Series
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Industrial DDR4 DRAM
Wide-temperature DDR4 DRAM chips; also used in GCC campaign LP.
Engineering guides
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Industrial Temperature Grades: An Engineering Guide to -40, -55, and Beyond
A practical engineering guide to industrial temperature grades: what -40°C~+85°C and -55°C~+105°C ratings actually mean, how they are tested...
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Samsung K4A8G165WC-BCWE Replacement: Loongtion DDR4 Wide-Temperature Cross-Reference
Samsung K4A8G165WC DDR4 replacement? Compare package, data rate and temperature grade with Loongtion YZ48G08V / YZ48G16V wide-temp parts.
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Winbond W957A6MB / Samsung K4U6E3S4AM Replacement: Loongtion LPDDR4X Cross-Reference Guide
Winbond W957A6MB or Samsung K4U6E3S4AM LPDDR4X replacement? Compare temperature grades, packages and density options with the Loongtion YZDB...
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Multi-Generational DRAM BOM Strategies: Balancing DDR3, DDR4, and DDR5 in Long-Life Industrial Designs
Industrial equipment such as PLCs, HMIs, and embedded controllers often have production lifecycles exceeding ten years. A product designed t...
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DDR4 Signal Integrity Debugging on Multi-Layer Industrial PCBs
You've qualified a DDR4 memory subsystem on a 16 layer industrial PCB at room temperature, only to have it produce intermittent data errors...
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DDR3 vs DDR4 in Industrial Embedded Systems: A Performance Trade-off Analysis for Migration Decisions
When Migration from DDR3 to DDR4 Makes Sense (and When It Doesn't)Industrial embedded system designers face a recurring dilemma: stick with...
