8Gb DDR4 DRAM Chip
High-performance Memory · Operating Temperature: -40℃~+85℃
Industrial DDR4 memory chips based on high-quality wafers from original manufacturers, which have undergone Industrial packaging and testing and wide-temperature optimization, boast high quality and are compatible with industrial embedded systems and high-end computing devices.
Designed specifically for Industrial Embedded Systems and High-end Computing Power Devices
High-Performance 8Gb DDR4 DRAM Chip, China Solution
Robust Industrial Storage Technology
High-Performance DDR4 Memory Solutions
High Quality
3200MHz High Frequency, Excellent Performance
Compatible with Micron, Samsung and CXMT Models
Complies with GJB7400 N1 Specification
Detailed Technical Specifications
Complete Specifications of Industrial 8Gb DDR4 DRAM Chip
Product Specifications
- Interface Type
- SSTL (DDR4)
- Package Type
- FBGA78/FBGA96
- Capacity Configuration
- 256Mb×16(4Gb)/512Mb×16(8Gb)/1Gb×8(8Gb)/2Gb×8(16Gb)
- Operating Temperature
- -40℃~+85℃
- Storage Temperature
- -45℃~+90℃
- Operating Frequency
- 3200MHz
- VDD = VDDQ
- 1.2V +/- 0.06V
- Bus Width
- x8/x16
- Nominal Capacity
- All 8Gb
- Reliability Standard
- GJB7400 Specification N1
- Replaceable Models
- Replaceable with corresponding models from Micron, Samsung, ChangXin, etc.
- Warranty Period
- 5 Years
Part Numbers
Orderable Part Numbers
Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.
| Part Number | Grade | Specification |
|---|---|---|
| YZ48G08V-F7HPI-M | Ind Ext | 1Gb×8 · FBGA78 · −55~105°C |
| YZ48G08V-F7HPI-M(0) | Ind WT | 1Gb×8 · FBGA78 · −40~85°C |
| YZ48G16V-F9HPI-M | Ind Ext | 512Mb×16 · FBGA96 · −55~105°C |
| YZ48G16V-F9HPI-M(0) | Ind WT | 512Mb×16 · FBGA96 · −40~85°C |
Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.
Compatibility Guide
Replacement / Cross-Reference
JEDEC-aligned Loongtion devices listed below are documented as pin-to-pin or functional alternatives to incumbent vendor part numbers. Verify fit with your BOM, PCB layout, and qualification plan — datasheet download available on request.
| Vendor PN | Loongtion PN | Compatibility | Summary | Details |
|---|---|---|---|---|
| Micron MT40A1G8WE-075EAIT:B | YZ48G08V-F7HPI-M(0) | Pin-to-Pin Compatible | 8Gb DDR4 monolithic DRAM, 1Gb×8, FBGA78, DDR4-3200, 1.2V, −40°C to +85°C industrial grade. | View → |
| Micron MT40A512M16JY-07EAIT:B | YZ48G16V-F9HPI-M(0) | Pin-to-Pin Compatible | 8Gb DDR4 monolithic DRAM, 512M×16, FBGA96, DDR4-3200, 1.2V, −40°C to +85°C industrial grade. | View → |
| ChangXin (CXMT) CXDQ3BFAM-WQ:A | YZ48G08V-F7HPI-M(0) | Cross-Reference | 8Gb DDR4, 1Gb×8, FBGA78, DDR4-3200 — documented application-case cross-reference for domestic platform BOMs (−40°C to +85°C industrial). | View → |
All manufacturer names, logos, and part numbers (such as Micron, Samsung, SK hynix, Kontron, and others) used on this website are for cross-reference and identification purposes only. These trademarks remain the property of their respective owners. Loongtion is not an authorized distributor or affiliate of these manufacturers.
Typical Application Scenarios
Wide-temperature DDR4 for outdoor cabinets, vehicle electronics, industrial gateways and GCC extreme-heat field deployments.
High-Quality Industrial High-Performance Server Memory
Applied to high-quality Industrial high-performance servers, the 3200MHz high frequency enhances server performance.
Application Effects
- High frequency enhances server performance
High-Quality Industrial Device for Replacing ChangXin CXDQ Series
Used to replace ChangXin CXDQ series, achieving high-quality replacement and meeting the upgrade requirements of Industrial devices.
Application Effects
- Can replace ChangXin's equivalent models
- Compatible with original system design
- High quality guarantees supply chain security
Related technical resources
- Whitepaper Industrial DDR4 Memory Selection Guide Selection criteria, reliability factors, and specification tables for industrial DDR4 DRAM chips.
- Article A Systematic Debugging Workflow for DDR4 Signal Integrity Issues in Industrial PCB Designs Learn a structured methodology to isolate and resolve crosstalk, impedance mismatches, and timing violations on multi-layer industrial PCBs using Loongtion industrial DDR4 features such as CA parity, write CRC, and programmable ODT.
Related products
SD NAND
Industrial-grade SD NAND memory chip, adopting original factory wide-temperature flash memory particles and high-reliability packaging technology. It is compatible with standard SD interface timing, featuring wide-temperature stability, low power consumption, and long service life, designed for industrial embedded systems, miniaturized devices, and harsh-environment storage.
LPDDR4X DRAM Chip
Industrial-grade LPDDR4X memory chip based on domestic original wafers, adopting low-power wide-temperature architecture and high-reliability packaging technology. It features ultra-low power consumption, high bandwidth, and wide-temperature stability, designed for mobile industrial control, portable devices, embedded systems, and domestic high-energy-efficiency scenarios.
16Gb DDR5 DRAM Chip
Industrial-grade DDR5 memory chip based on domestic original wafers, featuring industrial-grade wide-temperature testing and high-reliability packaging processes. It offers high data rate, low power consumption, and strong stability, suitable for high-end industrial computing, embedded control, and domestic core equipment.
DDR3 DRAM Chip
Based on high-quality Industrial DDR3 memory chips from original manufacturer Jinyuan, through wide-temperature screening and customized packaging and testing, it features medium-to-high quality and is compatible with industrial embedded systems and Industrial devices.
NAND Flash
Industrial NAND Flash chips in TLC configuration for embedded storage. ONFI 4.0 interface, up to 3000 program/erase cycles, I/O speed up to 800 MB/s, and wide-temperature operation from -40°C to +85°C for industrial control, smart terminals, and field equipment.
eMMC TLC
Industrial eMMC storage chip with integrated package of NAND flash memory and controller, adopting TLC flash type, featuring small size, low power consumption and high reliability, and compatible with industrial embedded systems and portable industrial devices.
Need application engineering or a custom storage solution?
Our engineers help with BOM review, compatibility validation, and storage selection for your project.