8Gb DDR4 DRAM Chip · Wide-temp · CN
Industrial DRAM for embedded systems
Key facts
What industrial buyers usually need to know first — before diving into the full datasheet.
5-year supply · 12-month EOL notice
Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.
MOQ from 1 pc
Prototype and repair lots without large inventory lock-in — then scale to production.
BOM review & firmware fit
We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.
5-year warranty · 4–8 weeks lead time
Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.
| MOQ | From 1 pc |
|---|---|
| Standard lead time | 4–8 weeks (typical; confirm with sales for your configuration) |
| Warranty | 5 years (see /warranty for tier details) |
| Supply commitment | Minimum 5 years for qualified SKUs · 12-month EOL notice |
| Engineering support | BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request |
Overview
Industrial DDR4 DRAM chip for harsh environments — high-frequency operation with wide-temperature screening and China-localized supply options for industrial servers, edge nodes, and embedded hosts migrating from DDR3.
Specifications
| Interface | DDR4 |
|---|---|
| Package | FBGA78/FBGA96 |
| Density | 256Mb×16(4Gb)/512Mb×16(8Gb)/1Gb×8(8Gb)/2Gb×8(16Gb) |
| Operating temperature | −40℃~+85℃ |
| Data rate | 3200MHz |
| Supply voltage | 1.2V +/- 0.06V |
| Supply option | China-localized (CN) |
| Warranty | 5 years |
Orderable part numbers
Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.
| Part number | Grade | Summary |
|---|---|---|
YZ48G08V-F7HPI-M |
GJB-STD | 8Gb · -55℃~+105℃· FBGA78 · xref MT40A1G8WE-075EAIT:B |
YZ48G08V-F7HPI-M(O) |
Wide-temp | 8Gb · -40℃~+85℃· FBGA78 · xref MT40A1G8WE-075EAIT:B |
YZ48G16V-F9HPI-M |
GJB-STD | 8Gb · -55℃~+105℃· FBGA96 · xref MT40A512M16JY-07EAIT:B |
YZ48G16V-F9HPI-M(O) |
Wide-temp | 8Gb · -40℃~+85℃· FBGA96 · xref MT40A512M16JY-07EAIT:B |
Cross-references
Vendor families for BOM exploration. Always validate ball map, speed bin, and temperature grade on your host.
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
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ISO 9001:2015 certified (GB/T 19001-2016)
Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
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Conforms to GJB 9001C—2017
Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Product & interface standards
This catalog SKU follows the industry specifications that define its form factor and host interface.
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JEDEC DRAM specifications
DDR3 / DDR4 / DDR5 / LPDDR families follow applicable JEDEC device and signaling specifications for the listed density, organization, and speed bin.
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JEDEC DDR SDRAM
DDR3 / DDR4 / DDR5 devices follow applicable JEDEC DDR specifications for the listed density, organization, and speed bin.
Grade wording: Product grade definition.
Key highlights
What matters for BOM review and board bring-up.
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DDR4 bandwidth
Higher data rates than DDR3 for industrial servers and next-gen embedded hosts.
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Wide-temp industrial grade
Rated for harsh environments with elevated temperature screening where specified.
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China-localized supply (CN)
Domestic supply options for CN-labeled programs.
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Drop-in planning
Use handbook PNs and cross-references on this page — confirm ball map and speed bin on your controller.
Typical applications
Where this SKU is commonly designed in.
Industrial servers & edge compute
Memory bandwidth for industrial servers and edge nodes still on DDR4 platforms.
- High-frequency DDR4
- Wide-temp duty
- CN supply path when required
Embedded controllers
Board designs migrating from DDR3 that need DDR4 density without jumping to DDR5.
- 8Gb density class
- Controller ball-map review
- Validate temperature bin
Series
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Industrial DDR4 DRAM
Wide-temperature DDR4 DRAM chips; also used in GCC campaign LP.
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Industrial DRAM Chips
Industrial solder-down DRAM: DDR3, DDR4, DDR5, LPDDR4X.
Frequently asked questions
What is the operating temperature range of the Loongtion DDR4 chip?
The Loongtion DDR4 DRAM chip (YZ48G series) is rated -40C to +85C wide-temperature industrial grade, maintaining full DDR4-3200 speed across the range. Comparable Micron parts drop to 2666 MHz at wide temperature.
Is this a drop-in replacement for Samsung K4A8G165WC?
Yes. YZ48G16V-F9HPI-M is a verified pin-to-pin replacement for Samsung K4A8G165WC-BCWE (8Gb, x16, FBGA96) and also covers Micron MT40A512M16JY-07EAIT:B. Note x8 parts (FBGA78) and x16 parts (FBGA96) have different ball maps and cannot be mixed.
What are the key specifications?
8Gb DDR4 SDRAM, 1.2V, DDR4-3200, FBGA78 (x8) / FBGA96 (x16), -40C to +85C. The (O) suffix denotes tray packaging, electrically identical.
What is the lead time?
Loongtion cross-reference replacements ship in 4-8 weeks, versus the 20-26 week industry average for industrial DDR4 during the EOL window.
What certifications does it carry?
RoHS/REACH compliant and qualified to JEDEC DDR4 industrial standards. Contact engineering for the full compliance statement.
Engineering guides
-
Industrial DDR5 Memory Selection Guide: What Actually Matters in 2026
A field guide to selecting industrial DDR5 DRAM: temperature grade, speed bin, ball map, and the supply question that decides long-lifecycle...
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DDR4 DRAM Chip Cross Reference: Complete Pin-to-Pin Replacement Guide for Industrial Engineers
A comprehensive guide to cross-referencing and replacing DDR4 8Gb DRAM chips (Micron MT40A1G8WE, MT40A512M16JY, Samsung K4A8G165WB, CXMT CXD...
-
DDR4 EOL and the Supply Window: Procurement Strategies for Industrial Memory
Samsung, SK Hynix, and Micron are exiting DDR4 while prices climb and industrial lead times stretch to 20-26 weeks. What procurement teams s...
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DDR3 Legacy Replacement: A Field Engineer's Guide
Field checklist for keeping long-life industrial DDR3 boards alive — package, organization, voltage, speed bin, and temperature grade — with...
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Multi-Generational DRAM BOM Strategies: Balancing DDR3, DDR4, and DDR5 in Long-Life Industrial Designs
Industrial equipment such as PLCs, HMIs, and embedded controllers often have production lifecycles exceeding ten years. A product designed t...
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DDR4 Signal Integrity Debugging on Multi-Layer Industrial PCBs
You've qualified a DDR4 memory subsystem on a 16 layer industrial PCB at room temperature, only to have it produce intermittent data errors...
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