8Gb DDR4 DRAM Chip (-55°C to +105°C)
Ultra-wide Temperature: -55℃~105℃ · 3200MHz High Frequency
High-quality 8Gb DDR4 DRAM chip, based on high-quality original Jinyuan dies, undergo packaging, testing and wide-temperature screening, making them compatible with industrial and specialized scenarios. With an operating frequency of 3200MHz, they support wide-temperature operation ranging from -55℃ to 105℃, and include documented cross-reference for select Micron FBGA78/FBGA96 industrial part numbers — verify pin map and speed grade with our datasheet before qualification
Product Features
Military-spec High-performance Memory Solution
Technical Advantages
Military-spec High-performance Storage Solution
High Quality
High Frequency of 3200MHz, Efficient Data Processing
Replaceable with Devices from Micron, Samsung, CXMT, etc.
Ultra-wide Operating Temperature Range: -55℃~105℃
Specifications
Detailed Technical Specifications
Product Specifications
- Interface Type
- DDR4 SSTL
- Package Type
- FBGA78/FBGA96
- Physical Dimensions
- 14.0mm×9.0mm×1.2mm
- Capacity Configuration
- 256Mb×16(4Gb)/512Mb×16(8Gb)/1Gb×8(8Gb)/2Gb×8(16Gb)
- Operating Temperature
- -55℃~105℃
- Storage Temperature
- -45℃~90℃
- Operating Frequency
- 3200MHz
- Bus Width
- x8/x16
- VDD = VDDQ
- 1.2V +/- 0.06V
- Reliability Standard
- Complies with GJB7400 N1 Specification Requirements
- Replaceable Models
- Replaceable with corresponding devices from Micron, Samsung, high-quality CXMT, etc.
- Warranty Period
- 5-Year Warranty Service
Part Numbers
Orderable Part Numbers
Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.
| Part Number | Grade | Specification |
|---|---|---|
| YZ48G08V-F7HPI-M | Ind Ext | 1Gb×8 · FBGA78 · −55~105°C |
| YZ48G08V-F7HPI-M(0) | Ind WT | 1Gb×8 · FBGA78 · −40~85°C |
| YZ48G16V-F9HPI-M | Ind Ext | 512Mb×16 · FBGA96 · −55~105°C |
| YZ48G16V-F9HPI-M(0) | Ind WT | 512Mb×16 · FBGA96 · −40~85°C |
Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.
Compatibility Guide
Replacement / Cross-Reference
JEDEC-aligned Loongtion devices listed below are documented as pin-to-pin or functional alternatives to incumbent vendor part numbers. Verify fit with your BOM, PCB layout, and qualification plan — datasheet download available on request.
| Vendor PN | Loongtion PN | Compatibility | Summary | Details |
|---|---|---|---|---|
| Micron MT40A512M16JY-07EAIT:B | YZ48G16V-F9HPI-M(0) | Pin-to-Pin Compatible | 8Gb DDR4 monolithic DRAM, 512M×16, FBGA96, DDR4-3200, 1.2V, −40°C to +85°C industrial grade. | View → |
All manufacturer names, logos, and part numbers (such as Micron, Samsung, SK hynix, Kontron, and others) used on this website are for cross-reference and identification purposes only. These trademarks remain the property of their respective owners. Loongtion is not an authorized distributor or affiliate of these manufacturers.
Application Cases
Military-spec 8Gb DDR4 DRAM chips for aerospace, rugged vehicle and outdoor embedded platforms in ultra-wide temperature environments.
High-end Industrial Control Equipment
Applied in high-end industrial control equipment, the 3200MHz high frequency ensures data processing efficiency, and its high quality meets high reliability requirements.
Application Effects
- 3200MHz High Frequency & High Efficiency
- High Quality & High Reliability
- Ultra-wide Temperature Range for Harsh Environments
Specialized Computing Terminal
Used in specialized computing terminals, it can replace corresponding components from Micron, Samsung, high-quality CXMT, etc.
Application Effects
- Replaceable with Various Domestic and Overseas Components
- Complies with GJB7400 N1 Specification
What “Military-spec” means on this website
How we use this label on our site — reliability tier, documentation, and use-case boundaries.
On this website, “Military-spec” refers to a higher-reliability product tier within our portfolio. It emphasizes environmental robustness, reliability validation, and manufacturing/quality controls that exceed typical consumer-grade products and, where stated for a given SKU, exceed the baseline of our standard Industrial offerings. This label is used to reduce confusion between product grades and does not constitute a representation that any product is suitable for any particular application, including military end-use.
Any differences versus Industrial are defined per SKU in the applicable datasheet / technical documentation (for example: wider operating temperature, stricter mechanical/climatic stress validation, tighter consistency and traceability controls, where applicable).
GJB (if referenced for a product): applicable clauses, test items, and whether requirements apply to product specifications versus management system certification scope are governed solely by that product’s technical documentation and, where applicable, the scope of certification. For additional documentation, please contact us (additional materials may be provided under NDA or after customer qualification, as applicable).
Important: “Military-spec” does not mean the products are marketed as dedicated for military end-use, and it does not imply government endorsement or inclusion on any procurement qualified list, unless separately documented on a dedicated page with authoritative evidence.
Customers are responsible for ensuring lawful procurement and use under applicable laws and regulations.
Related technical resources
- Whitepaper Industrial DDR4 Memory Selection Guide Selection criteria, reliability factors, and specification tables for industrial DDR4 DRAM chips.
- Article DDR4 Signal Integrity Debugging on Multi-Layer Industrial PCBs Practical guidance on selecting oscilloscope probes, setting up measurements, and interpreting waveforms for debugging DDR4 signal integrity on industrial multi-layer PCBs. Based on application notes from the Loongtion 8Gb DDR4 DRAM chip whitepaper.
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Need application engineering or a custom storage solution?
Our engineers help with BOM review, compatibility validation, and storage selection for your project.