Wide-temp · DRAM
−40°C to +85°C wide-temperature DDR and LPDDR chips for industrial SoCs, edge compute, and embedded controllers. Advantages include stable industrial supply options, temperature bins matched to the field, and packages suited to compact board layouts. Typical deployments: factory floors, outdoor cabinets, transportation, energy, and edge outdoor gear. Exact ratings stay SKU-specific in the datasheet. Commercial terms: minimum 5-year supply with 12-month EOL notice; MOQ from 1 pc; BOM review and firmware adaptation on request; 5-year warranty; typical 4–8 weeks lead time.
8Gb DDR4 DRAM Chip · Wide-temp
- Both wafer and package
- FBGA78/FBGA96 package
- Supports VDD(VDDQ) 1.2V +/-
8Gb DDR4 DRAM Chip · Wide-temp · CN
- DDR4 bandwidth
- China-localized supply (CN)
- Drop-in planning
DDR3 DRAM Chip · Wide-temp · CN
- Both Wafer and Packaging &
- Standard SSTL Interface
- Supports Dual Voltages
Industrial 16Gb DDR5 DRAM Chip
- DDR5 bandwidth
- 1.1 V operation
- WBGA-82 · ×8
LPDDR4X DRAM Chip
- Slim FBGA178/FBGA200 package
- 0.6V core ultra-low voltage
- 100% domestic solution
NAND Flash
- Complies with ONFI 4.0
- TLC type, 3000 P/E cycles
- I/O speed up to 800 MB/s
NAND Flash Chip
- ONFI 4.0 standard interface
- TLC type with up to 3000 P/E
- BGA132 and BGA152 packages
Applications
All applicationsTypical industries where Loongtion wide-temp storage is designed in — with recent field notes below.