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LPDDR4X DRAM Chip

Ultra-Low Power · 3200~4266MHz · Wide-Temp -40℃~+85℃

Industrial-grade LPDDR4X memory chip based on domestic original wafers, adopting low-power wide-temperature architecture and high-reliability packaging technology. It features ultra-low power consumption, high bandwidth, and wide-temperature stability, designed for mobile industrial control, portable devices, embedded systems, and domestic high-energy-efficiency scenarios.

Operating Temperature
-40℃~+85℃
Capacity Range
2GB-8GB
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LPDDR4X DRAM Chip — product image
Product Features

High-Efficiency Industrial LPDDR4X DRAM Chip

Low power consumption, wide temperature range, high bandwidth, suitable for portable industrial control and embedded devices

1

Slim FBGA178/FBGA200 package, x16/x32 bit width, 3200~4266MHz high frequency, significantly improved bandwidth

2

0.6V core ultra-low voltage, 15%~20% lower power consumption than LPDDR4, better heat dissipation

3

Industrial-grade -40℃~+85℃ wide temperature range, passed GJB7400 N1 specification

4

100% domestic solution optional, ZZKK certification applicable, compatible with foreign models

5

Supports data checking and signal integrity optimization, suitable for 7×24 continuous operation

Technical Advantages

Industrial Low-Power Memory Technology

Slim Low-Power, Wide-Temp High-Reliability Industrial LPDDR4X Solution

1

3200~4266MHz high-frequency & high-bandwidth, stronger performance

2

0.6V ultra-low power consumption, better durability and heat dissipation

3

-40℃~+85℃ wide temperature range, adaptable to harsh environments

4

Domestic + ZZKK certification, independent and controllable

Technical Specifications

Detailed Technical Specifications

Complete Parameters of Industrial LPDDR4X Memory Chip

Product Specifications

Interface Type
LPDDR4X SSTL
Package Type
FBGA200
Capacity Configuration
2GB/4GB/8GB
Operating Temperature
-40℃~+85℃
Storage Temperature
-45℃~+90℃
Operating Frequency
3733MHz~4266MHz
Supply Voltage
0.6V/1.1V
Bit Width
×16
Error Checking
Supported
Reliability Standard
GJB7400 N1 Specification
Domestic Certification
ZZKK Applicable
Warranty Period
5 Years

Part Numbers

Orderable Part Numbers

Verified Loongtion part numbers for this product line. Copy a PN into your BOM or inquiry — confirm package, temperature grade, and firmware with engineering before production.

Part Number Grade Specification
YMDB5CCBM-EA-A Ind Ext 2GB · ×16 · FBGA200 · −55~105°C
YMDB6CCBM-EA-A Ind Ext 4GB · ×16 · FBGA200 · −55~105°C
YZDB5CCBM-EA-A Ind WT 2GB · ×16 · FBGA200 · −40~85°C
YZDB6CBAM-MA-B Ind WT 4GB · dual-channel stack · FBGA200 · −40~85°C
YZDB6CCBM-EA-A Ind WT 4GB · ×16 · FBGA200 · −40~85°C
YZDB6CCDM-EA-A Ind WT 8GB · ×16 · FBGA200 · −40~85°C
YZDB7CCDM-EA-A Ind WT 8GB -40℃~+85℃ FBGA200 3733/4266Mbps

Need a Micron, Samsung, or other incumbent cross-reference? See the part-number cross-reference catalog.

Application Cases

Industrial Portable & Embedded Scenario Verification

Low-power LPDDR4X DRAM chips for portable industrial HMI, mobile edge devices and energy-efficient embedded controllers.

1

Portable Rugged Industrial Terminal Memory

Used in handheld/portable rugged terminals, low power consumption for long battery life, wide temperature range ensures stable outdoor operation.

Application Effects

  • Ultra-low power extends battery life
  • Slim package saves space
  • Wide temperature ensures stable operation
2

Embedded Domestic Core Board Memory

Used in embedded core boards and fanless industrial computers, low power consumption and high reliability, compatible with domestic platforms.

Application Effects

  • High-frequency & high-bandwidth improves performance
  • Domestic meets independent controllability
  • Low power suitable for fanless devices

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