Loongtion
Industrial DDR chips for OEM boards that see weather, heat, and long life
For hardware and component engineers at industrial / embedded OEMs — solder-down DDR3, DDR4, DDR5, and LPDDR4X with Industrial WT (−40~85°C) and Ext (−55~105°C) grades, all China-localized (CN). Free datasheet, remote fit review, low MOQ.
- CNChina-localized
- −40~85°CIndustrial WT
- −55~125°CDDR3 GJB Ext
- GJB-STDgrade on select Ext SKUs
CN = China-localized supply for domestic-label programs. GJB-STD is a product grade — reliability tier and documentation, not a military end-use claim. Read the product grade definition
If you own the BOM, this will sound familiar
- Consumer or “industrial-labeled” DRAM that still fails cold boot or sealed-cabinet heat.
- A long-life platform stuck on DDR3 / DDR4 with shrinking supply and no pin-compatible path.
- Quotes without a firm window — or a broker who cannot own footprint, temp grade, or incumbent PN match.
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Inquire free Datasheet PDF + quotation on your email thread.
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Confirm fit Remote BOM / drawing review before you buy samples.
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Sample, then scale Low MOQ when stocked; bulk typically 4–8 weeks.
Four DRAM lines
Solder-down memory chips only — eMMC and NVMe BGA are separate campaigns for different buyers. Each line below is China-localized (CN); free datasheet PDF on each card.
Industrial DDR3 DRAM Chip
Keep long-lifecycle controllers and maintenance boards on DDR3 — CN supply without hunting broker stock.
2–8Gb · FBGA96 ×16 · JEDEC DDR3 · China-localized (CN)
Ind WT −40~85°C · GJB Ext −55~125°C
Industrial 8Gb DDR4 DRAM Chip
Solder-down CN DDR4 for outdoor cabinets, edge gateways, and transport electronics.
8Gb / 1GB per chip · ×8 / ×16 · up to 3200 MT/s · China-localized (CN)
Ind WT −40~85°C
Industrial 16Gb DDR5 DRAM Chip
Next-platform embedded DRAM with on-die ECC, industrial screening, and CN supply.
16Gb / 2GB per chip · WBGA-82 · up to 6400 MT/s · China-localized (CN)
Ind WT −40~85°C
Industrial LPDDR4X DRAM Chip
Low-power SoC designs — handheld terminals, compact edge, battery-aware boards with CN labeling.
2–8GB · 200-ball FBGA · 3733 / 4266 MT/s · China-localized (CN)
Ind WT −40~85°C
Cross-reference incumbent PNs
Documented vendor → Loongtion mappings for BOM shortlisting. Always validate package, speed bin / firmware, and temperature grade on your host.
Browse the full cross-reference catalog · Ask engineering for a BOM match
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
- ISO 9001:2015 certified (GB/T 19001-2016) Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
- Conforms to GJB 9001C—2017 Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Environmental methods (GJB-STD)
For Extreme-temp / GJB-STD SKUs, environmental planning and screening reference the following methods. This is not a claim of third-party product certification under these standards.
- GJB 150A (aligned with MIL-STD-810 methods) Military equipment laboratory environmental test methods. GJB-STD SKUs are designed and screened with reference to GJB 150A; it is the Chinese military counterpart commonly mapped to MIL-STD-810 style environmental methods.
Product & interface standards
Catalog SKUs follow the industry specifications that define their form factor and host interface.
- JEDEC DRAM specifications DDR3 / DDR4 / DDR5 / LPDDR families follow applicable JEDEC device and signaling specifications for the listed density, organization, and speed bin.
- JEDEC DDR SDRAM DDR3 / DDR4 / DDR5 devices follow applicable JEDEC DDR specifications for the listed density, organization, and speed bin.
- JEDEC LPDDR Low-power DRAM devices follow applicable JEDEC LPDDR specifications for the listed density and speed bin.
Grade wording for Wide-temp vs Extreme-temp / GJB-STD: Product grade definition.
What this program is built for
- Built for the boards you ship IPC, outdoor cabinets, energy, transport, and factory edge — solder-down DRAM with real enclosure grades, not desktop bins.
- China-localized (CN) across the line These four DRAM chips carry the CN badge — domestic supply path for programs that need China-localized labeling, not import-only catalogs.
- Industrial WT and Ext grades −40~85°C (Ind WT) across the DRAM line; DDR3 GJB Ext is −55~125°C per handbook. Select Ext SKUs use our GJB-STD grade definition.
- One DRAM team, pilot-friendly MOQ DDR3 / DDR4 / DDR5 / LPDDR4X under one engineering owner. From 1 pc when stocked — prove fit before bulk.
Need the formal wording for GJB-STD? Product grade definition
Who ships this
Loongtion is a China-based industrial memory manufacturer — design and screening in Xi’an, shipment from Ningbo. China-localized (CN) DRAM lines for OEM pilots and production; not a trading desk.
What you receive
- PDF datasheet for the line you select
- Commercial quotation (grade, qty, destination)
- Free BOM & drawing review on request
No public price list. Sample and bulk terms quoted per line. Qualified bulk programs may include a 5-year free replacement policy — ask on your quote thread.
FAQ
Who is this page for?
Hardware and component engineers at industrial / embedded OEMs — teams selecting solder-down DDR for outdoor, sealed, transport, energy, or long-lifecycle platforms. It is not a consumer PC memory page.
What does the CN badge mean?
CN means China-localized supply on that SKU — domestic labeling for programs that require a China-localized BOM path. On this campaign, DDR3 / DDR4 / DDR5 / LPDDR4X lines are CN.
What does GJB-STD mean here?
GJB-STD is a product grade label on selected Ext-temperature SKUs: reliability tier, documentation, and screening as defined on our product grade page. It does not mean the parts are marketed for military end-use.
Do you publish a price list?
No. We quote by grade, quantity, and destination so lead time and commercial terms stay accurate.
Can you help if I only have an incumbent PN?
Yes — send the PN or BOM. We recommend a Loongtion match and note footprint / temp grade differences.
What about eMMC or NVMe BGA?
Those serve different buyers and live on separate pages. This campaign covers solder-down DRAM chips only.
How fast do you reply?
Usually within one business day on China business days (Mon–Fri, UTC+8; excl. public holidays) — datasheet and quote on the same thread.