Industrial DDR3 DRAM

Series overview

Loongtion industrial DDR3 DRAM keeps long-lifecycle PLC, DCS, railway, and medical boards alive when mainstream suppliers push DDR4/DDR5. This series covers 2Gb–8Gb FBGA96 paths with commercial, wide-temp (−40°C to +85°C), and GJB extreme-temp options. Use it when the SoC memory controller is still DDR3 and the program needs controlled BOM plus multi-year supply — not a consumer module rebranded as industrial. Typical buyers are OEMs sustaining a qualified platform for five to ten years who cannot redesign the memory interface solely because an incumbent PN went EOL. The product cards below list the active Loongtion DDR3 SKUs; each page states density, organization, voltage, temperature grade, and documented cross-reference families so BOM owners can shortlist without guessing ball maps.

Technical points to align

Key alignment points are organization (×16 vs TwinDie), package/ball map (typically FBGA96), voltage (1.35V DDR3L / 1.5V DDR3), and speed bin. Loongtion dual-voltage bins and wider temperature grades often cover outdoor cabinets and cold-start hosts where commercial DDR3 fails. Always confirm rank map and datasheet timing before a drop-in claim. Documented functional or pin-to-pin paths include common Micron MT41K*, Samsung K4B*, SK hynix H5TQ*, and ISSI IS43TR* class parts — each cross-reference page states the compatibility level (Pin-to-Pin / Functional / Possible) explicitly. TwinDie and stacked organizations need extra care on rank and address maps; density alone is never enough for a pin-to-pin swap. Screening and industrial temperature grades are SKU-defined in the datasheet — use the handbook envelope as a guide, then validate on the target board across the full ambient range of the enclosure.

How to select in this series

Start from the incumbent PN on your BOM, then open the part-number cross-reference for Micron / Samsung / SK hynix / ISSI mappings. Shortlist the matching Loongtion density and temperature grade on the product cards below, then request the datasheet. For field replacements, read the industrial DDR3 selection guide. If you are comparing generations, also see industrial DDR4 before committing to a board respin. Form-level browsing of all solder-down DRAM is available at industrial DRAM chips. When in doubt, send the schematic snippet and incumbent PN to application engineering for a fit check rather than assuming a mechanical drop-in from a catalog density match.