SSD Wide-temp Rugged

Rugged NVMe SSD

20,000g Acceleration · High-Speed Connectors

Operating temperature -40℃~+85℃
Capacity 512GB-2TB
Rugged NVMe SSD

Key facts

What industrial buyers usually need to know first — before diving into the full datasheet.

5-year supply · 12-month EOL notice

Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.

MOQ from 1 pc

Prototype and repair lots without large inventory lock-in — then scale to production.

BOM review & firmware fit

We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.

5-year warranty · 4–8 weeks lead time

Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.

MOQ From 1 pc
Standard lead time 4–8 weeks (typical; confirm with sales for your configuration)
Warranty 5 years (see /warranty for tier details)
Supply commitment Minimum 5 years for qualified SKUs · 12-month EOL notice
Engineering support BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request
Samples Available on request

Overview

Ruggedized NVMe storage drive, customized for specialized industrial scenarios such as missile-borne and ship-borne applications, is equipped with high-speed connectors and Industrial flash chips, features vibration and shock resistance, and meets the high-speed data recording requirements in extreme industrial environments.

Specifications

Interface PCIe Gen3×4 (NVMe)
Connector Samtec High-Speed Connector
Capacity Options 512GB/1TB/2TB
Operating temperature -40℃~+85℃
Storage temperature -45℃~+90℃
Read Speed Up to 1500MB/s
Write Speed Up to 1200MB/s
Flash Type TLC (Kioxia Industrial)
Shock Resistance 20,000g Acceleration
Reliability Standard Passed Harsh Environmental Tests
Compatible Platforms Industrial FPGA Platforms such as Xilinx XC7020-2CLG484I
Warranty Period 5 Years

Orderable part numbers

Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.

Part numberGradeSummary
YIDJ01THQS-D Wide-temp 1TB · -40℃~+85℃
YIDJ01TNZT-S Wide-temp 1TB · TLC · -40℃~+85℃
YIDJ02TNZT-S Wide-temp 2TB · TLC · -40℃~+85℃
YIDJ512HQS-D Wide-temp 512GB · -40℃~+85℃
YIDJ512NZT-S Wide-temp 512GB · TLC · -40℃~+85℃

Cross-references

No verified one-to-one vendor PN is published for this SKU yet. Browse the part-number catalog or contact engineering for BOM matching.

Compliance & Standards

Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.

Quality management system

  • ISO 9001:2015 certified (GB/T 19001-2016)
    Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
  • Conforms to GJB 9001C—2017
    Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).

Product & interface standards

This catalog SKU follows the industry specifications that define its form factor and host interface.

  • Industry SSD host interfaces
    Host interface, command set, and form-factor behavior follow the applicable SATA, NVMe, or eMMC specification listed on the datasheet.
  • NVM Express (NVMe)
    Command set and PCIe-attached storage behavior conform to the NVMe specification revision applicable to the listed SKU.
  • PCI Express
    Physical and link-layer attachment follows the PCIe generation and lane width stated on the datasheet (for example PCIe 3.0 ×4).

Grade wording: Product grade definition.

Key highlights

Tailored specifically for special industrial scenarios including missile-borne and ship-borne applications

  • Adopts Samtec high-speed
    connectors housing and internal structures are ruggedized to withstand strong vibration and shock (e.g., missile-borne 20,000g acceleration environment)
  • PCIe Gen3×4 lanes
    supports NVMe protocol, maximum sequential read speed up to 1500MB/s, maximum sequential write speed up to 1200MB/s
  • Wide operating temperature
    range of -40℃~+85℃, storage temperature range of -45℃~+90℃, adaptable to special industrial environments
  • Capacity
    512GB~2TB (TLC flash memory), compatible with Industrial FPGA platforms such as Xilinx XC7020-2CLG484I
  • Adopts Kioxia Industrial TLC
    chips passes rigorous environmental tests to ensure no data loss under extreme conditions

Typical applications

Designed for outdoor cabinets, mobile surveillance, railway and energy field equipment where operating temperature and vibration exceed consumer SSD limits.

Missile-borne Data Recording Device

Applied to missile-borne data recording devices, it withstands 20,000g acceleration impact and ensures no data loss in extreme environments.

  • Withstands 20,000g acceleration impact
  • High-speed recording meets missile-borne requirements
  • Kioxia Industrial chips ensure reliability

High-speed Storage for Special Industrial Testing Equipment

Used in special industrial testing equipment, the high-speed PCIe interface meets real-time data recording requirements.

  • High-speed PCIe meets real-time recording requirements
  • Reinforced design adapts to harsh environments
  • Compatible with industrial FPGA platforms

Engineering guides