LPDDR4X DRAM Chip
Ultra-low-power LPDDR4X for edge designs
Key facts
What industrial buyers usually need to know first — before diving into the full datasheet.
5-year supply · 12-month EOL notice
Qualified SKUs stay available for long-lifecycle equipment — you get advance notice before any discontinuation.
MOQ from 1 pc
Prototype and repair lots without large inventory lock-in — then scale to production.
BOM review & firmware fit
We help match incumbent PNs, validate drop-in paths, and can adjust firmware / grade when the catalog needs a tweak.
5-year warranty · 4–8 weeks lead time
Stable production scheduling with a typical 4–8 weeks lead time once configuration and forecast are agreed.
| MOQ | From 1 pc |
|---|---|
| Standard lead time | 4–8 weeks (typical; confirm with sales for your configuration) |
| Warranty | 5 years (see /warranty for tier details) |
| Supply commitment | Minimum 5 years for qualified SKUs · 12-month EOL notice |
| Engineering support | BOM review, drop-in / fit checks, firmware and temperature-grade adaptation on request |
Overview
Industrial-grade LPDDR4X memory chip based on domestic original wafers, adopting low-power wide-temperature architecture and high-reliability packaging technology. It features ultra-low power consumption, high bandwidth, and wide-temperature stability, designed for mobile industrial control, portable devices, embedded systems, and domestic high-energy-efficiency scenarios.
Specifications
| Interface | LPDDR4X SSTL |
|---|---|
| Package | FBGA200 |
| Capacity Configuration | 2GB/4GB/8GB |
| Operating temperature | -40℃~+85℃ |
| Storage temperature | -45℃~+90℃ |
| Operating Frequency | 3733MHz~4266MHz |
| Supply voltage | 0.6V/1.1V |
| Bit width | ×16 |
| Error checking | Supported |
| Domestic Certification | ZZKK Applicable |
| Warranty Period | 5 Years |
Orderable part numbers
Handbook PNs for this page. Confirm package, temperature bin, and speed grade before production.
| Part number | Grade | Summary |
|---|---|---|
YZDB5CCBM-EA-A |
Wide-temp | 2GB · FBGA200 · 3733/4266Mbps · -40℃~+85℃ |
YZDB6CCBM-EA-A |
Wide-temp | 4GB · FBGA200 · 3733/4266Mbps · -40℃~+85℃ |
YZDB7CCDM-EA-A |
Wide-temp | 8GB · FBGA200 · 3733/4266Mbps · -40℃~+85℃ |
Cross-references
Vendor families for BOM exploration. Always validate ball map, speed bin, and temperature grade on your host.
Compliance & Standards
Quality and release processes for Loongtion industrial memory and storage. Formal certificates and scope statements are available in the quotation pack on request.
Quality management system
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ISO 9001:2015 certified (GB/T 19001-2016)
Quality management systems — Requirements. Certified quality system covering semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
-
Conforms to GJB 9001C—2017
Quality management systems — Requirements. Quality system practices conform to GJB 9001C for the same scope: semiconductor integrated circuits and solid-state storage modules (design, development, production, and technical support) and hybrid integrated circuits (design, development, and technical support).
Product & interface standards
This catalog SKU follows the industry specifications that define its form factor and host interface.
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JEDEC DRAM specifications
DDR3 / DDR4 / DDR5 / LPDDR families follow applicable JEDEC device and signaling specifications for the listed density, organization, and speed bin.
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JEDEC LPDDR
Low-power DRAM devices follow applicable JEDEC LPDDR specifications for the listed density and speed bin.
-
JEDEC DDR SDRAM
DDR3 / DDR4 / DDR5 devices follow applicable JEDEC DDR specifications for the listed density, organization, and speed bin.
Grade wording: Product grade definition.
Key highlights
Low power consumption, wide-temp range, high bandwidth, suitable for portable industrial control and embedded devices
-
Slim FBGA178/FBGA200 package
x16/x32 bit width, 3200~4266MHz high frequency, significantly improved bandwidth
-
0.6V core ultra-low voltage
15%~20% lower power consumption than LPDDR4, better heat dissipation
-
100% domestic solution
optional ZZKK certification applicable, compatible with foreign models
-
Supports data checking
and signal integrity optimization, suitable for 7×24 continuous operation
Typical applications
Low-power LPDDR4X DRAM chips for portable industrial HMI, mobile edge devices and energy-efficient embedded controllers.
Portable Rugged Industrial Terminal Memory
Used in handheld/portable rugged terminals, low power consumption for long battery life, wide-temp range ensures stable outdoor operation.
- Ultra-low power extends battery life
- Slim package saves space
- wide-temp ensures stable operation
Embedded Domestic Core Board Memory
Used in embedded core boards and fanless industrial computers, low power consumption and high reliability, compatible with domestic platforms.
- High-frequency & high-bandwidth improves performance
- Domestic meets independent controllability
- Low power suitable for fanless devices
Series
-
Industrial LPDDR4X
Wide-temperature LPDDR4X for SoC designs.
-
Industrial DRAM Chips
Industrial solder-down DRAM: DDR3, DDR4, DDR5, LPDDR4X.
Frequently asked questions
What is the operating temperature range of the Loongtion LPDDR4X chip?
YZDB series is rated -40C to +85C industrial wide-temperature, a 15C advantage over Samsung K4U6E3S4AM-MGC1 (-25C to +85C) for outdoor or unheated deployments.
Is this a drop-in replacement for Winbond/Samsung LPDDR4X?
Yes. YZDB family covers Winbond W957A6MB and Samsung K4U6E3S4AM cross-references (2GB-8GB, FBGA178/FBGA200, density migration without package change). ISSI/Alliance LPDDR4 parts run 1.1V and are not fully compatible with the 0.6V-core LPDDR4X - verify before substituting.
What are the key specifications?
LPDDR4X (0.6V core + 1.8V I/O), 2GB-8GB, -40C to +85C, FBGA178/FBGA200, 100% domestic supply chain.
What is the lead time?
4-8 weeks for standard industrial orders.
Engineering guides
-
Industrial DDR5 Memory Selection Guide: What Actually Matters in 2026
A field guide to selecting industrial DDR5 DRAM: temperature grade, speed bin, ball map, and the supply question that decides long-lifecycle...
-
DDR3 Legacy Replacement: A Field Engineer's Guide
Field checklist for keeping long-life industrial DDR3 boards alive — package, organization, voltage, speed bin, and temperature grade — with...
-
Multi-Generational DRAM BOM Strategies: Balancing DDR3, DDR4, and DDR5 in Long-Life Industrial Designs
Industrial equipment such as PLCs, HMIs, and embedded controllers often have production lifecycles exceeding ten years. A product designed t...
-
Achieving High Reliability with LPDDR4X in Industrial Edge Computing
Industrial edge computing systems—vision inspection platforms, real time control gateways, and AI inference nodes—demand memory that can sus...
-
LPDDR4X for Low-Power Industrial Platforms: A Technical Guide
Industrial embedded systems increasingly require high memory bandwidth with tight power budgets. LPDDR4X, originally developed for mobile de...
-
LPDDR4X Embedded Design: Architecture, Power, and Layout for Industrial Systems
LPDDR4X is the low power evolution of DDR4, optimized for bandwidth and energy efficiency in space constrained embedded systems. Loongtion's...
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