Industrial Memory Chips · DRAM
Industrial memory chips and embedded industrial DRAM — DDR3, DDR4, DDR5, and LPDDR4X for industrial SoCs, edge compute, and embedded controllers. Stable supply options, wide-temperature bins, and package choices that fit compact board layouts where DRAM reliability and lifecycle matter. Shortlist by density and grade, then confirm ball map via datasheet or cross-reference before design-in. Commercial terms: minimum 5-year supply with 12-month EOL notice; MOQ from 1 pc; BOM review and firmware adaptation on request; 5-year warranty; typical 4–8 weeks lead time.
What this DRAM hub covers
Industrial DRAM and industrial memory chips on this page include DDR3, DDR4, DDR5, and LPDDR4X solder-down paths for SoCs, PLCs, edge gateways, and long-lifecycle controllers. Filter by interface when you already know the memory standard, or open a series hub for denser selection copy: DDR3, DDR4, DDR5, LPDDR4X.
Selection checklist
Align organization and ball map (×8 vs ×16, FBGA78 vs FBGA96, FBGA200 for LPDDR4X), voltage domain, speed bin, and temperature grade before design-in. Use part-number cross-reference when replacing Micron, Samsung, SK hynix, CXMT, ISSI, or Winbond incumbents. Datasheets remain the authority for timing and screening.
8Gb DDR4 DRAM Chip · Wide-temp
- Both wafer and package
- FBGA78/FBGA96 package
- Supports VDD(VDDQ) 1.2V +/-
8Gb DDR4 DRAM Chip · Wide-temp · CN
- DDR4 bandwidth
- China-localized supply (CN)
- Drop-in planning
DDR3 DRAM Chip · Extreme · CN
- FBGA96 · ×16
- Dual-voltage rail
- China-localized supply (CN)
DDR3 DRAM Chip · Wide-temp · CN
- Both Wafer and Packaging &
- Standard SSTL Interface
- Supports Dual Voltages
Industrial 16Gb DDR5 DRAM Chip
- DDR5 bandwidth
- 1.1 V operation
- WBGA-82 · ×8
LPDDR4X DRAM Chip
- Slim FBGA178/FBGA200 package
- 0.6V core ultra-low voltage
- 100% domestic solution