1. Executive Summary
Ningbo Loongtion Intelligent Technology Co., Ltd. (Loongtion®) presents the Loongtion 8GB DDR4 SDRAM, a JEDEC-compliant high-speed dynamic random access memory solution engineered for demanding industrial, embedded, medical, and commercial applications. This product delivers a per-die density of 8Gb in x8 (1G × 8) and x16 (512M × 16) configurations, supporting transfer rates up to DDR4-3200 (3200 MT/s).
Key differentiators include wide industrial temperature range options spanning –40°C to +85°C and an extended range of –55°C to +105°C, robust reliability features such as Command/Address (CA) parity, write CRC, on-die termination (ODT), and Post-Package Repair (PPR) support. Advanced power management through Max Power Saving Mode and Fine Granularity Refresh (FGR) enables efficient operation across varied thermal environments.
The Loongtion 8GB DDR4 SDRAM is well-suited for target markets including industrial automation, embedded systems, medical devices, networking and telecommunications infrastructure, and commercial computing platforms requiring high reliability, long lifecycle support, and JEDEC-standard electrical and timing compliance.
\Note: Specific module-level capacities (e.g., 8GB as a single- or multi-die product) are not detailed in source documentation; the documented density per DRAM die is 8Gb.\
2. Product Overview
The Loongtion 8GB DDR4 SDRAM is a high-speed, double-data-rate synchronous DRAM designed in accordance with the JEDEC Standard No. 79-4 for DDR4 SDRAM. The product is available in two die configurations: x8 (1G × 8) and x16 (512M × 16), supporting a maximum data transfer rate of 3200 MT/s. The device operates from a nominal power supply of 1.2 V (VDD = VDDQ) with a separate 2.5 V VPP supply.
2.1 Part Numbers
| Part Number | Configuration | Package | Temperature Range |
|---|---|---|---|
| YZ48G08V-F7HPI-M(0) | 8Gb, 1G × 8 | 78-ball FBGA | –40°C to +85°C |
| YZ48G08V-F7HPI-M | 8Gb, 1G × 8 | 78-ball FBGA | –55°C to +105°C |
| YZ48G16V-F9HPI-M(0) | 8Gb, 512M × 16 | 96-ball FBGA | –40°C to +85°C |
| YZ48G16V-F9HPI-M | 8Gb, 512M × 16 | 96-ball FBGA | –55°C to +105°C |
2.2 Document Revision History
RevisionDate| Parameter | Specification |
|---|---|
| Description | Rev 1.0 2023/05 Initial Draft Rev 1.1 2023/06 Official Release Rev 1.2 2025/03 Updated Dimensions Rev 1.3 2025/10 Updated Reset and Initialization Description |